JPS5299068A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5299068A
JPS5299068A JP1616176A JP1616176A JPS5299068A JP S5299068 A JPS5299068 A JP S5299068A JP 1616176 A JP1616176 A JP 1616176A JP 1616176 A JP1616176 A JP 1616176A JP S5299068 A JPS5299068 A JP S5299068A
Authority
JP
Japan
Prior art keywords
semiconductor device
schottky electrode
soldering
solder
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1616176A
Other languages
Japanese (ja)
Other versions
JPS5823951B2 (en
Inventor
Hisao Kondo
Aiichiro Nara
Takeji Fujiwara
Masao Sumiyoshi
Hideaki Ikegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP51016161A priority Critical patent/JPS5823951B2/en
Publication of JPS5299068A publication Critical patent/JPS5299068A/en
Publication of JPS5823951B2 publication Critical patent/JPS5823951B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: A semiconductor device which is so arranged to prevent spreading of solder to the stepped part of a Schottky electrode and the outside circumference beyond that part in soldering a lead wire to the Schottky electrode.
COPYRIGHT: (C)1977,JPO&Japio
JP51016161A 1976-02-17 1976-02-17 semiconductor equipment Expired JPS5823951B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51016161A JPS5823951B2 (en) 1976-02-17 1976-02-17 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51016161A JPS5823951B2 (en) 1976-02-17 1976-02-17 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5299068A true JPS5299068A (en) 1977-08-19
JPS5823951B2 JPS5823951B2 (en) 1983-05-18

Family

ID=11908774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51016161A Expired JPS5823951B2 (en) 1976-02-17 1976-02-17 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5823951B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588324A (en) * 1978-12-27 1980-07-04 Nec Home Electronics Ltd Manufacture of semiconductor ohmic layer
JPH0563024A (en) * 1991-04-10 1993-03-12 Internatl Business Mach Corp <Ibm> Multi-layered alloy structure for electrical components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5280778A (en) * 1975-12-27 1977-07-06 Sanken Electric Co Ltd Schottky barier semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5280778A (en) * 1975-12-27 1977-07-06 Sanken Electric Co Ltd Schottky barier semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588324A (en) * 1978-12-27 1980-07-04 Nec Home Electronics Ltd Manufacture of semiconductor ohmic layer
JPH0563024A (en) * 1991-04-10 1993-03-12 Internatl Business Mach Corp <Ibm> Multi-layered alloy structure for electrical components

Also Published As

Publication number Publication date
JPS5823951B2 (en) 1983-05-18

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