JPS5271981A - Aligning device for bonders - Google Patents

Aligning device for bonders

Info

Publication number
JPS5271981A
JPS5271981A JP50147971A JP14797175A JPS5271981A JP S5271981 A JPS5271981 A JP S5271981A JP 50147971 A JP50147971 A JP 50147971A JP 14797175 A JP14797175 A JP 14797175A JP S5271981 A JPS5271981 A JP S5271981A
Authority
JP
Japan
Prior art keywords
bonders
aligning device
control
pluralit
monitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50147971A
Other languages
Japanese (ja)
Inventor
Katsuyuki Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP50147971A priority Critical patent/JPS5271981A/en
Publication of JPS5271981A publication Critical patent/JPS5271981A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE: To control a pluralit of bonders one after another with one operator by performing alignment of semiconductor pellets in X, Y directions and rotating direction from the monitors in a control desk.
COPYRIGHT: (C)1977,JPO&Japio
JP50147971A 1975-12-11 1975-12-11 Aligning device for bonders Pending JPS5271981A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50147971A JPS5271981A (en) 1975-12-11 1975-12-11 Aligning device for bonders

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50147971A JPS5271981A (en) 1975-12-11 1975-12-11 Aligning device for bonders

Publications (1)

Publication Number Publication Date
JPS5271981A true JPS5271981A (en) 1977-06-15

Family

ID=15442231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50147971A Pending JPS5271981A (en) 1975-12-11 1975-12-11 Aligning device for bonders

Country Status (1)

Country Link
JP (1) JPS5271981A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
KR20170122723A (en) 2015-03-23 2017-11-06 신닛테츠스미킨 카부시키카이샤 Hot-rolled steel sheet, manufacturing method thereof, and method of manufacturing cold-rolled steel sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
KR20170122723A (en) 2015-03-23 2017-11-06 신닛테츠스미킨 카부시키카이샤 Hot-rolled steel sheet, manufacturing method thereof, and method of manufacturing cold-rolled steel sheet

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