JPS5538014A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5538014A
JPS5538014A JP11044878A JP11044878A JPS5538014A JP S5538014 A JPS5538014 A JP S5538014A JP 11044878 A JP11044878 A JP 11044878A JP 11044878 A JP11044878 A JP 11044878A JP S5538014 A JPS5538014 A JP S5538014A
Authority
JP
Japan
Prior art keywords
wire
resin
electrode
wedge
coating step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11044878A
Other languages
Japanese (ja)
Inventor
Mitsuharu Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP11044878A priority Critical patent/JPS5538014A/en
Publication of JPS5538014A publication Critical patent/JPS5538014A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07131—Means for applying material, e.g. for deposition or forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To simplify resin-filling process and also to reduce volume of resin in use by covering surrounding of a wire, including an electrode section, with high- purity liquid resin while a wire is being connected to the electrode.
CONSTITUTION: At first, a wedge 1 is lowered on a semiconductor part 5 piled on a supporting table 4, and while keeping a resin-coating step 3 separated from a wire 2, the wire 2 is pressingly attached securaly to No.1 electrode 51. At the time when the wedge 1 is raised, a resin flow guide 33 of the resin coating step 3 is lowered to such an extent that its top end contacts the wire 2, and while the wedge 1 is shifting, liquid resin 31, equivalent in volume to air poured into a container 32 through a pipe 34, is made to flow onto stick-out sections of the electrode 51 and the wire 2. The wedge 1 is again lowered above an electrode 52 and the resin coating step 3 is raised, and while keeping the guide 33 separated from the wire 2, the wire 2 is fixed onto the electrode 52. After the wire 2 is cut off, the electrode 52 is also covered with resin by shifting of liquid resin 31.
COPYRIGHT: (C)1980,JPO&Japio
JP11044878A 1978-09-08 1978-09-08 Wire bonding device Pending JPS5538014A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11044878A JPS5538014A (en) 1978-09-08 1978-09-08 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11044878A JPS5538014A (en) 1978-09-08 1978-09-08 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS5538014A true JPS5538014A (en) 1980-03-17

Family

ID=14535966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11044878A Pending JPS5538014A (en) 1978-09-08 1978-09-08 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5538014A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268979A (en) * 1985-03-25 1986-11-28 ル−トウイツヒ・リ−トハムメル・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング Method and device for ensuring separation of gas current having different atmosphere
JPS63238221A (en) * 1987-03-26 1988-10-04 Furukawa Electric Co Ltd:The Continuous bright annealing furnace
JPH0196333A (en) * 1987-10-08 1989-04-14 Nkk Corp Continuous annealing furnace provided with gas circulating device
JPH03135042A (en) * 1989-10-20 1991-06-10 Nippon Steel Corp Bonding of bonding wire and coating apparatus used therefor
US20140311836A1 (en) * 2011-11-11 2014-10-23 Wabco Radbremsen Gmbh Disk brake, and pressure plate and brake pad for such a disk brake

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279657A (en) * 1975-12-25 1977-07-04 Mitsubishi Electric Corp Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279657A (en) * 1975-12-25 1977-07-04 Mitsubishi Electric Corp Wire bonding device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268979A (en) * 1985-03-25 1986-11-28 ル−トウイツヒ・リ−トハムメル・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング Method and device for ensuring separation of gas current having different atmosphere
JPS63238221A (en) * 1987-03-26 1988-10-04 Furukawa Electric Co Ltd:The Continuous bright annealing furnace
JPH0196333A (en) * 1987-10-08 1989-04-14 Nkk Corp Continuous annealing furnace provided with gas circulating device
JPH03135042A (en) * 1989-10-20 1991-06-10 Nippon Steel Corp Bonding of bonding wire and coating apparatus used therefor
US20140311836A1 (en) * 2011-11-11 2014-10-23 Wabco Radbremsen Gmbh Disk brake, and pressure plate and brake pad for such a disk brake
US9291226B2 (en) * 2011-11-11 2016-03-22 Wabco Radbremsen Gmbh Disk brake, and pressure plate and brake pad for such a disk brake

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