JPS5281046A - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device

Info

Publication number
JPS5281046A
JPS5281046A JP50158355A JP15835575A JPS5281046A JP S5281046 A JPS5281046 A JP S5281046A JP 50158355 A JP50158355 A JP 50158355A JP 15835575 A JP15835575 A JP 15835575A JP S5281046 A JPS5281046 A JP S5281046A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
ultrasonic wire
ultrasonic
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50158355A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5630118B2 (mo
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP50158355A priority Critical patent/JPS5281046A/ja
Publication of JPS5281046A publication Critical patent/JPS5281046A/ja
Publication of JPS5630118B2 publication Critical patent/JPS5630118B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP50158355A 1975-12-27 1975-12-27 Ultrasonic wire bonding device Granted JPS5281046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50158355A JPS5281046A (en) 1975-12-27 1975-12-27 Ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50158355A JPS5281046A (en) 1975-12-27 1975-12-27 Ultrasonic wire bonding device

Publications (2)

Publication Number Publication Date
JPS5281046A true JPS5281046A (en) 1977-07-07
JPS5630118B2 JPS5630118B2 (mo) 1981-07-13

Family

ID=15669839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50158355A Granted JPS5281046A (en) 1975-12-27 1975-12-27 Ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPS5281046A (mo)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182825U (mo) * 1984-11-07 1986-05-31

Also Published As

Publication number Publication date
JPS5630118B2 (mo) 1981-07-13

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