JPS5285468A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5285468A
JPS5285468A JP155376A JP155376A JPS5285468A JP S5285468 A JPS5285468 A JP S5285468A JP 155376 A JP155376 A JP 155376A JP 155376 A JP155376 A JP 155376A JP S5285468 A JPS5285468 A JP S5285468A
Authority
JP
Japan
Prior art keywords
forming
production
semiconductor device
bump
uniform thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP155376A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Kiichi Jinriki
Hiroshi Kato
Kenichi Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP155376A priority Critical patent/JPS5285468A/en
Publication of JPS5285468A publication Critical patent/JPS5285468A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To form bump electrodes of a uniform thickness by forming a first bump which withstands heat and pressure during bonding after forming underlaying metal, then forming a second bump of good bonding characteristics and electric conductivity.
COPYRIGHT: (C)1977,JPO&Japio
JP155376A 1976-01-09 1976-01-09 Production of semiconductor device Pending JPS5285468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP155376A JPS5285468A (en) 1976-01-09 1976-01-09 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP155376A JPS5285468A (en) 1976-01-09 1976-01-09 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5285468A true JPS5285468A (en) 1977-07-15

Family

ID=11504707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP155376A Pending JPS5285468A (en) 1976-01-09 1976-01-09 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5285468A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142843U (en) * 1984-08-21 1986-03-19 富士電機株式会社 semiconductor equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142843U (en) * 1984-08-21 1986-03-19 富士電機株式会社 semiconductor equipment

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