JPS5268366A - Solder vamp formation onto semiconductor substrate - Google Patents

Solder vamp formation onto semiconductor substrate

Info

Publication number
JPS5268366A
JPS5268366A JP50143965A JP14396575A JPS5268366A JP S5268366 A JPS5268366 A JP S5268366A JP 50143965 A JP50143965 A JP 50143965A JP 14396575 A JP14396575 A JP 14396575A JP S5268366 A JPS5268366 A JP S5268366A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
solder
onto semiconductor
formation onto
vamp formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50143965A
Other languages
Japanese (ja)
Other versions
JPS5935178B2 (en
Inventor
Kazuo Umeyama
Zenzo Tajima
Kunio Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50143965A priority Critical patent/JPS5935178B2/en
Publication of JPS5268366A publication Critical patent/JPS5268366A/en
Publication of JPS5935178B2 publication Critical patent/JPS5935178B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: When solder vamp is formed at electrode section on semiconductor substrate, the hole of metal mask is made into oval shape instead of round shape in the direction where no effect is given to adjacent electrodes. In this way, a sufficient solder amount can be secured.
COPYRIGHT: (C)1977,JPO&Japio
JP50143965A 1975-12-05 1975-12-05 Method of forming solder bumps on electrodes on semiconductor substrates Expired JPS5935178B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50143965A JPS5935178B2 (en) 1975-12-05 1975-12-05 Method of forming solder bumps on electrodes on semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50143965A JPS5935178B2 (en) 1975-12-05 1975-12-05 Method of forming solder bumps on electrodes on semiconductor substrates

Publications (2)

Publication Number Publication Date
JPS5268366A true JPS5268366A (en) 1977-06-07
JPS5935178B2 JPS5935178B2 (en) 1984-08-27

Family

ID=15351161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50143965A Expired JPS5935178B2 (en) 1975-12-05 1975-12-05 Method of forming solder bumps on electrodes on semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS5935178B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163232A (en) * 2002-11-21 2003-06-06 Fujitsu Ltd Method of forming spare solder
US7378296B2 (en) 2003-02-25 2008-05-27 Kyocera Corporation Print mask and method of manufacturing electronic components using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163232A (en) * 2002-11-21 2003-06-06 Fujitsu Ltd Method of forming spare solder
US7378296B2 (en) 2003-02-25 2008-05-27 Kyocera Corporation Print mask and method of manufacturing electronic components using the same
US7638420B2 (en) 2003-02-25 2009-12-29 Kyocera Corporation Print mask and method of manufacturing electronic components using the same

Also Published As

Publication number Publication date
JPS5935178B2 (en) 1984-08-27

Similar Documents

Publication Publication Date Title
JPS52140269A (en) Formation of solder electrode
JPS523387A (en) Manufacturing method of semiconductor device
JPS548972A (en) Forming method for fine electrode of semiconductor element
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS51140565A (en) Semiconductor unit
JPS5271978A (en) Production of semiconductor device
JPS535571A (en) Circuit block and its manufacture
JPS5228262A (en) Process for assembling semiconductor device
JPS52153383A (en) Preparation of semiconductor device
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5422171A (en) Manufacture of semiconductor device
JPS5364467A (en) Electrode
JPS53140967A (en) Production of electrodes of semiconductor device
JPS5412265A (en) Production of semiconductor elements
JPS5299068A (en) Semiconductor device
JPS52130292A (en) Patterning method
JPS545659A (en) Manufacture of semiconductor device
JPS52155972A (en) Production of semiconductor device
JPS52126167A (en) Formation of electrode for semiconductor device
JPS53139476A (en) Manufacture of semiconductor device
JPS5338978A (en) Manufacture of semiconductor device
JPS53124065A (en) Manufacture of semiconductor device
JPS52146564A (en) Production of extra-high-frequency integrated circuit substrates
JPS52155055A (en) Production of semiconductor device
JPS53123076A (en) Production of semiconductor elements