JPS5299070A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5299070A
JPS5299070A JP1610776A JP1610776A JPS5299070A JP S5299070 A JPS5299070 A JP S5299070A JP 1610776 A JP1610776 A JP 1610776A JP 1610776 A JP1610776 A JP 1610776A JP S5299070 A JPS5299070 A JP S5299070A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
parts
plating
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1610776A
Other languages
Japanese (ja)
Other versions
JPS5914895B2 (en
Inventor
Toshikatsu Tsunehiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP51016107A priority Critical patent/JPS5914895B2/en
Publication of JPS5299070A publication Critical patent/JPS5299070A/en
Publication of JPS5914895B2 publication Critical patent/JPS5914895B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate bulging by heating by machining the surface of the parts to be secured with semiconductor elements and electrode lead-out parts, then plating these parts.
JP51016107A 1976-02-17 1976-02-17 Method for forming lead frames for semiconductor devices Expired JPS5914895B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51016107A JPS5914895B2 (en) 1976-02-17 1976-02-17 Method for forming lead frames for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51016107A JPS5914895B2 (en) 1976-02-17 1976-02-17 Method for forming lead frames for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5299070A true JPS5299070A (en) 1977-08-19
JPS5914895B2 JPS5914895B2 (en) 1984-04-06

Family

ID=11907281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51016107A Expired JPS5914895B2 (en) 1976-02-17 1976-02-17 Method for forming lead frames for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5914895B2 (en)

Also Published As

Publication number Publication date
JPS5914895B2 (en) 1984-04-06

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