JPS5366369A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5366369A
JPS5366369A JP14271576A JP14271576A JPS5366369A JP S5366369 A JPS5366369 A JP S5366369A JP 14271576 A JP14271576 A JP 14271576A JP 14271576 A JP14271576 A JP 14271576A JP S5366369 A JPS5366369 A JP S5366369A
Authority
JP
Japan
Prior art keywords
connection
semiconductor device
providing
electrode
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14271576A
Other languages
Japanese (ja)
Inventor
Takahiko Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14271576A priority Critical patent/JPS5366369A/en
Publication of JPS5366369A publication Critical patent/JPS5366369A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To make easy the connection between the electrode of the semiconductor substrate and the lead wire, by providing projections for positioning with the external drawing lead connection and by providing notching holes with the connection of the connecting piece corresponding to these.
JP14271576A 1976-11-26 1976-11-26 Semiconductor device Pending JPS5366369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14271576A JPS5366369A (en) 1976-11-26 1976-11-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14271576A JPS5366369A (en) 1976-11-26 1976-11-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5366369A true JPS5366369A (en) 1978-06-13

Family

ID=15321882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14271576A Pending JPS5366369A (en) 1976-11-26 1976-11-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5366369A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169477A (en) * 2011-02-15 2012-09-06 Shindengen Electric Mfg Co Ltd Semiconductor device
DE102014118628A1 (en) * 2014-12-15 2016-06-16 Infineon Technologies Ag Bonding slip, carrier and method of making a bonding clip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012169477A (en) * 2011-02-15 2012-09-06 Shindengen Electric Mfg Co Ltd Semiconductor device
DE102014118628A1 (en) * 2014-12-15 2016-06-16 Infineon Technologies Ag Bonding slip, carrier and method of making a bonding clip

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