JPS53112059A - Gold wire for bonding semiconductor - Google Patents

Gold wire for bonding semiconductor

Info

Publication number
JPS53112059A
JPS53112059A JP2729177A JP2729177A JPS53112059A JP S53112059 A JPS53112059 A JP S53112059A JP 2729177 A JP2729177 A JP 2729177A JP 2729177 A JP2729177 A JP 2729177A JP S53112059 A JPS53112059 A JP S53112059A
Authority
JP
Japan
Prior art keywords
gold wire
bonding semiconductor
bonding
semiconductor
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2729177A
Other languages
Japanese (ja)
Other versions
JPS5826662B2 (en
Inventor
Shiyouzou Hayashi
Nobuyuki Tadokoro
Susumu Tomiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP52027291A priority Critical patent/JPS5826662B2/en
Publication of JPS53112059A publication Critical patent/JPS53112059A/en
Publication of JPS5826662B2 publication Critical patent/JPS5826662B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP52027291A 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices Expired JPS5826662B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52027291A JPS5826662B2 (en) 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52027291A JPS5826662B2 (en) 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices

Publications (2)

Publication Number Publication Date
JPS53112059A true JPS53112059A (en) 1978-09-30
JPS5826662B2 JPS5826662B2 (en) 1983-06-04

Family

ID=12216965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52027291A Expired JPS5826662B2 (en) 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5826662B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154242A (en) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp Fine wire of gold alloy for bonding semiconductor element
JPS59119752A (en) * 1982-12-24 1984-07-11 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS6030158A (en) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd Bonding wire
JPS6478698A (en) * 1987-09-21 1989-03-24 Mitsubishi Metal Corp Ribbon foil material of au alloy for brazing semiconductor device without degrading in hardness with age
JPH04214828A (en) * 1991-01-29 1992-08-05 Mitsubishi Materials Corp Gold alloy thin wire for bonding semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272625A (en) * 1965-10-18 1966-09-13 James Cohn Beryllium-gold alloy and article made therefrom

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272625A (en) * 1965-10-18 1966-09-13 James Cohn Beryllium-gold alloy and article made therefrom

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154242A (en) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp Fine wire of gold alloy for bonding semiconductor element
JPS59119752A (en) * 1982-12-24 1984-07-11 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS6030158A (en) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd Bonding wire
JPS6478698A (en) * 1987-09-21 1989-03-24 Mitsubishi Metal Corp Ribbon foil material of au alloy for brazing semiconductor device without degrading in hardness with age
JPH04214828A (en) * 1991-01-29 1992-08-05 Mitsubishi Materials Corp Gold alloy thin wire for bonding semiconductor device

Also Published As

Publication number Publication date
JPS5826662B2 (en) 1983-06-04

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