JPS5317072A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS5317072A
JPS5317072A JP9111076A JP9111076A JPS5317072A JP S5317072 A JPS5317072 A JP S5317072A JP 9111076 A JP9111076 A JP 9111076A JP 9111076 A JP9111076 A JP 9111076A JP S5317072 A JPS5317072 A JP S5317072A
Authority
JP
Japan
Prior art keywords
flat plate
plate form
package
semiconductor device
form metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9111076A
Other languages
Japanese (ja)
Inventor
Takeshi Kato
Shinzo Anazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9111076A priority Critical patent/JPS5317072A/en
Publication of JPS5317072A publication Critical patent/JPS5317072A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate stress transmission to dielectric members and evade the occurrence of cracking by bulging the semiconductor element securing part of a metal heat sink to a convex shape, braxing a flat plate form metal member having a hole fitting to this bulged part to the lateral surface of the bulged part and further brazing a dielectric member to the circumference of the surface of the flat plate form metal member.
COPYRIGHT: (C)1978,JPO&Japio
JP9111076A 1976-07-30 1976-07-30 Package for semiconductor device Pending JPS5317072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9111076A JPS5317072A (en) 1976-07-30 1976-07-30 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9111076A JPS5317072A (en) 1976-07-30 1976-07-30 Package for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5317072A true JPS5317072A (en) 1978-02-16

Family

ID=14017370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9111076A Pending JPS5317072A (en) 1976-07-30 1976-07-30 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5317072A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131163U (en) * 1983-02-23 1984-09-03 日本特殊陶業株式会社 semiconductor container
EP0654820A3 (en) * 1993-11-08 1995-10-11 Eupec Gmbh & Co Kg Semiconductor module.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131163U (en) * 1983-02-23 1984-09-03 日本特殊陶業株式会社 semiconductor container
EP0654820A3 (en) * 1993-11-08 1995-10-11 Eupec Gmbh & Co Kg Semiconductor module.

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