JPS5546558A - Metallic cover plate for semiconductor package - Google Patents

Metallic cover plate for semiconductor package

Info

Publication number
JPS5546558A
JPS5546558A JP12023778A JP12023778A JPS5546558A JP S5546558 A JPS5546558 A JP S5546558A JP 12023778 A JP12023778 A JP 12023778A JP 12023778 A JP12023778 A JP 12023778A JP S5546558 A JPS5546558 A JP S5546558A
Authority
JP
Japan
Prior art keywords
cover plate
solder material
semiconductor package
metallic cover
wettability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12023778A
Other languages
Japanese (ja)
Inventor
Teiichi Endo
Kazuo Usada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12023778A priority Critical patent/JPS5546558A/en
Publication of JPS5546558A publication Critical patent/JPS5546558A/en
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent solder material from creeping onto the upper surface of a cover plate for a semiconductor package by forming metal or alloy layer having improper wettability for the solder material onto the upper or upper and side surfaces of the metallic cover plate.
CONSTITUTION: A layer 11 of nickel or the like having proper wettability for solder material is formed on one side of a stainless steel plate 13 having improper wettability for solder material. When a ceramic package is sealed with solder using this cover plate, solder material 7 does not creep onto the upper and side surfaces 15 and 16 of the cover plate 14.
COPYRIGHT: (C)1980,JPO&Japio
JP12023778A 1978-09-29 1978-09-29 Metallic cover plate for semiconductor package Pending JPS5546558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12023778A JPS5546558A (en) 1978-09-29 1978-09-29 Metallic cover plate for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12023778A JPS5546558A (en) 1978-09-29 1978-09-29 Metallic cover plate for semiconductor package

Publications (1)

Publication Number Publication Date
JPS5546558A true JPS5546558A (en) 1980-04-01

Family

ID=14781228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12023778A Pending JPS5546558A (en) 1978-09-29 1978-09-29 Metallic cover plate for semiconductor package

Country Status (1)

Country Link
JP (1) JPS5546558A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57110352U (en) * 1980-12-26 1982-07-08
JPS57112054A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Semiconductor device
JPS57139610A (en) * 1981-02-25 1982-08-28 Kazukado Ose Calipers
JPS57180153A (en) * 1981-04-30 1982-11-06 Mitsubishi Metal Corp Sealing plate for ceramic integrated circuit unit
JPS5875849A (en) * 1981-10-31 1983-05-07 Tanaka Denshi Kogyo Kk Sealing cover for ic package
JPS5875850A (en) * 1981-10-31 1983-05-07 Tanaka Denshi Kogyo Kk Sealing cover for ic package and forming method thereof
JPS62217642A (en) * 1986-03-18 1987-09-25 Kyocera Corp Package for containing hybrid integrated circuit element
US7173331B2 (en) 2003-02-06 2007-02-06 Neomax Materials Co., Ltd. Hermetic sealing cap and method of manufacturing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57110352U (en) * 1980-12-26 1982-07-08
JPS57112054A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Semiconductor device
JPS57139610A (en) * 1981-02-25 1982-08-28 Kazukado Ose Calipers
JPS57180153A (en) * 1981-04-30 1982-11-06 Mitsubishi Metal Corp Sealing plate for ceramic integrated circuit unit
JPS5875849A (en) * 1981-10-31 1983-05-07 Tanaka Denshi Kogyo Kk Sealing cover for ic package
JPS5875850A (en) * 1981-10-31 1983-05-07 Tanaka Denshi Kogyo Kk Sealing cover for ic package and forming method thereof
JPS62217642A (en) * 1986-03-18 1987-09-25 Kyocera Corp Package for containing hybrid integrated circuit element
US7173331B2 (en) 2003-02-06 2007-02-06 Neomax Materials Co., Ltd. Hermetic sealing cap and method of manufacturing the same

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