JPS5320194A - Method for polishing both surfaces undistortedly - Google Patents

Method for polishing both surfaces undistortedly

Info

Publication number
JPS5320194A
JPS5320194A JP9432776A JP9432776A JPS5320194A JP S5320194 A JPS5320194 A JP S5320194A JP 9432776 A JP9432776 A JP 9432776A JP 9432776 A JP9432776 A JP 9432776A JP S5320194 A JPS5320194 A JP S5320194A
Authority
JP
Japan
Prior art keywords
polishing
undistortedly
single crystal
crystal wafer
polish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9432776A
Other languages
Japanese (ja)
Inventor
Michio Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9432776A priority Critical patent/JPS5320194A/en
Publication of JPS5320194A publication Critical patent/JPS5320194A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To polish both surfaces of a single crystal wafer undistortedly and rapidly by immersing the single crystal wafer in polishing liquid, and performing chemical and mechanical composite polishing on a polishing cloth.
JP9432776A 1976-08-06 1976-08-06 Method for polishing both surfaces undistortedly Pending JPS5320194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9432776A JPS5320194A (en) 1976-08-06 1976-08-06 Method for polishing both surfaces undistortedly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9432776A JPS5320194A (en) 1976-08-06 1976-08-06 Method for polishing both surfaces undistortedly

Publications (1)

Publication Number Publication Date
JPS5320194A true JPS5320194A (en) 1978-02-24

Family

ID=14107174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9432776A Pending JPS5320194A (en) 1976-08-06 1976-08-06 Method for polishing both surfaces undistortedly

Country Status (1)

Country Link
JP (1) JPS5320194A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580881A (en) * 1978-12-12 1980-06-18 Nec Corp Polishing method for single-crystal substrate
JPH03221368A (en) * 1989-11-10 1991-09-30 Fujikoshi Kikai Kogyo Kk Wafer machining device
JPH04307935A (en) * 1991-04-05 1992-10-30 Fujikoshi Kikai Kogyo Kk Double-side simultaneous grinding method of wafer and device thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5139497A (en) * 1974-09-30 1976-04-02 Hitachi Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5139497A (en) * 1974-09-30 1976-04-02 Hitachi Ltd

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580881A (en) * 1978-12-12 1980-06-18 Nec Corp Polishing method for single-crystal substrate
JPH03221368A (en) * 1989-11-10 1991-09-30 Fujikoshi Kikai Kogyo Kk Wafer machining device
JPH04307935A (en) * 1991-04-05 1992-10-30 Fujikoshi Kikai Kogyo Kk Double-side simultaneous grinding method of wafer and device thereof

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