JPS5329068A - Automatic wire bonding unit - Google Patents

Automatic wire bonding unit

Info

Publication number
JPS5329068A
JPS5329068A JP10384076A JP10384076A JPS5329068A JP S5329068 A JPS5329068 A JP S5329068A JP 10384076 A JP10384076 A JP 10384076A JP 10384076 A JP10384076 A JP 10384076A JP S5329068 A JPS5329068 A JP S5329068A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding unit
automatic wire
conversion coefficient
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10384076A
Other languages
English (en)
Other versions
JPS5729845B2 (ja
Inventor
Kazuyuki Morita
Kazuo Yoshimoto
Tsunehiro Kajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10384076A priority Critical patent/JPS5329068A/ja
Publication of JPS5329068A publication Critical patent/JPS5329068A/ja
Publication of JPS5729845B2 publication Critical patent/JPS5729845B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding

Landscapes

  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP10384076A 1976-08-31 1976-08-31 Automatic wire bonding unit Granted JPS5329068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10384076A JPS5329068A (en) 1976-08-31 1976-08-31 Automatic wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10384076A JPS5329068A (en) 1976-08-31 1976-08-31 Automatic wire bonding unit

Publications (2)

Publication Number Publication Date
JPS5329068A true JPS5329068A (en) 1978-03-17
JPS5729845B2 JPS5729845B2 (ja) 1982-06-25

Family

ID=14364614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10384076A Granted JPS5329068A (en) 1976-08-31 1976-08-31 Automatic wire bonding unit

Country Status (1)

Country Link
JP (1) JPS5329068A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110244A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Printed circuit board for semiconductor device and wire bonding method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132944A (ja) * 1987-11-18 1989-05-25 Yamatoya Shokai:Kk 高周波を利用した測定溶液中の成分測定計

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110244A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Printed circuit board for semiconductor device and wire bonding method thereof

Also Published As

Publication number Publication date
JPS5729845B2 (ja) 1982-06-25

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