JPS5729845B2 - - Google Patents
Info
- Publication number
- JPS5729845B2 JPS5729845B2 JP10384076A JP10384076A JPS5729845B2 JP S5729845 B2 JPS5729845 B2 JP S5729845B2 JP 10384076 A JP10384076 A JP 10384076A JP 10384076 A JP10384076 A JP 10384076A JP S5729845 B2 JPS5729845 B2 JP S5729845B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10384076A JPS5329068A (en) | 1976-08-31 | 1976-08-31 | Automatic wire bonding unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10384076A JPS5329068A (en) | 1976-08-31 | 1976-08-31 | Automatic wire bonding unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5329068A JPS5329068A (en) | 1978-03-17 |
| JPS5729845B2 true JPS5729845B2 (ja) | 1982-06-25 |
Family
ID=14364614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10384076A Granted JPS5329068A (en) | 1976-08-31 | 1976-08-31 | Automatic wire bonding unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5329068A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132944A (ja) * | 1987-11-18 | 1989-05-25 | Yamatoya Shokai:Kk | 高周波を利用した測定溶液中の成分測定計 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110244A (en) * | 1980-02-06 | 1981-09-01 | Hitachi Ltd | Printed circuit board for semiconductor device and wire bonding method thereof |
-
1976
- 1976-08-31 JP JP10384076A patent/JPS5329068A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01132944A (ja) * | 1987-11-18 | 1989-05-25 | Yamatoya Shokai:Kk | 高周波を利用した測定溶液中の成分測定計 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5329068A (en) | 1978-03-17 |