JPS533065A - Package of semiconductor circuit device - Google Patents

Package of semiconductor circuit device

Info

Publication number
JPS533065A
JPS533065A JP7695076A JP7695076A JPS533065A JP S533065 A JPS533065 A JP S533065A JP 7695076 A JP7695076 A JP 7695076A JP 7695076 A JP7695076 A JP 7695076A JP S533065 A JPS533065 A JP S533065A
Authority
JP
Japan
Prior art keywords
package
circuit device
semiconductor circuit
perpendiculary
notches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7695076A
Other languages
Japanese (ja)
Other versions
JPS5745065B2 (en
Inventor
Katsuhiko Suzuki
Mototsugu Okura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7695076A priority Critical patent/JPS533065A/en
Publication of JPS533065A publication Critical patent/JPS533065A/en
Publication of JPS5745065B2 publication Critical patent/JPS5745065B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE: To prevent mutual contact by inserting IC devices to the notches of the wall members and protection plates mounted perpendiculary to a flat plate.
COPYRIGHT: (C)1978,JPO&Japio
JP7695076A 1976-06-29 1976-06-29 Package of semiconductor circuit device Granted JPS533065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7695076A JPS533065A (en) 1976-06-29 1976-06-29 Package of semiconductor circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7695076A JPS533065A (en) 1976-06-29 1976-06-29 Package of semiconductor circuit device

Publications (2)

Publication Number Publication Date
JPS533065A true JPS533065A (en) 1978-01-12
JPS5745065B2 JPS5745065B2 (en) 1982-09-25

Family

ID=13620038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7695076A Granted JPS533065A (en) 1976-06-29 1976-06-29 Package of semiconductor circuit device

Country Status (1)

Country Link
JP (1) JPS533065A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937795U (en) * 1982-09-02 1984-03-09 日本電気株式会社 parts storage tray
JPS63151038A (en) * 1986-12-16 1988-06-23 Tokyo Electron Ltd Method of feeding and inspecting package having different configuration
US5463251A (en) * 1992-07-08 1995-10-31 Mitsubishi Denki Kabushiki Kaisha Power semiconductor package having improved durability

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508859U (en) * 1973-05-21 1975-01-29
JPS5062465U (en) * 1973-10-11 1975-06-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508859U (en) * 1973-05-21 1975-01-29
JPS5062465U (en) * 1973-10-11 1975-06-07

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937795U (en) * 1982-09-02 1984-03-09 日本電気株式会社 parts storage tray
JPS63151038A (en) * 1986-12-16 1988-06-23 Tokyo Electron Ltd Method of feeding and inspecting package having different configuration
US5463251A (en) * 1992-07-08 1995-10-31 Mitsubishi Denki Kabushiki Kaisha Power semiconductor package having improved durability

Also Published As

Publication number Publication date
JPS5745065B2 (en) 1982-09-25

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