JPS51118965A - Insulation film of semiconductor device - Google Patents

Insulation film of semiconductor device

Info

Publication number
JPS51118965A
JPS51118965A JP51017950A JP1795076A JPS51118965A JP S51118965 A JPS51118965 A JP S51118965A JP 51017950 A JP51017950 A JP 51017950A JP 1795076 A JP1795076 A JP 1795076A JP S51118965 A JPS51118965 A JP S51118965A
Authority
JP
Japan
Prior art keywords
insulation film
semiconductor device
electrode
capacity
reduce
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51017950A
Other languages
Japanese (ja)
Other versions
JPS5343013B2 (en
Inventor
Masami Tomono
Toru Abe
Yukiyoshi Harada
Kikuji Sato
Takeshi Takagi
Genichi Kamoshita
Yuichiro Ooya
Atsushi Saiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51017950A priority Critical patent/JPS51118965A/en
Publication of JPS51118965A publication Critical patent/JPS51118965A/en
Publication of JPS5343013B2 publication Critical patent/JPS5343013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To reduce the capacity between electrode and semiconductor base by forming a new polyimide resin film on an insulation film.
COPYRIGHT: (C)1976,JPO&Japio
JP51017950A 1976-02-23 1976-02-23 Insulation film of semiconductor device Granted JPS51118965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51017950A JPS51118965A (en) 1976-02-23 1976-02-23 Insulation film of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51017950A JPS51118965A (en) 1976-02-23 1976-02-23 Insulation film of semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP47103588A Division JPS5131185B2 (en) 1972-10-18 1972-10-18

Publications (2)

Publication Number Publication Date
JPS51118965A true JPS51118965A (en) 1976-10-19
JPS5343013B2 JPS5343013B2 (en) 1978-11-16

Family

ID=11958035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51017950A Granted JPS51118965A (en) 1976-02-23 1976-02-23 Insulation film of semiconductor device

Country Status (1)

Country Link
JP (1) JPS51118965A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204277A (en) * 1992-09-10 1994-07-22 Texas Instr Inc <Ti> Method of wire bonding and integrated circuit device made thereby

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0683144U (en) * 1993-04-23 1994-11-29 新日本製鐵株式会社 Tundish weir for continuous casting
JP6429033B2 (en) * 2016-01-15 2018-11-28 株式会社ダイフク Mechanical equipment control system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204277A (en) * 1992-09-10 1994-07-22 Texas Instr Inc <Ti> Method of wire bonding and integrated circuit device made thereby

Also Published As

Publication number Publication date
JPS5343013B2 (en) 1978-11-16

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