JPS5347275A - Assembling method of semiconductor device - Google Patents

Assembling method of semiconductor device

Info

Publication number
JPS5347275A
JPS5347275A JP12245476A JP12245476A JPS5347275A JP S5347275 A JPS5347275 A JP S5347275A JP 12245476 A JP12245476 A JP 12245476A JP 12245476 A JP12245476 A JP 12245476A JP S5347275 A JPS5347275 A JP S5347275A
Authority
JP
Japan
Prior art keywords
semiconductor device
assembling method
lead frames
bondingis
accurately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12245476A
Other languages
Japanese (ja)
Inventor
Yoshifumi Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12245476A priority Critical patent/JPS5347275A/en
Publication of JPS5347275A publication Critical patent/JPS5347275A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: In a semiconductor pellet detecting process and an automatic wire bonding process for lead frames, the fixing means and heating system of the lead frames are made identical, whereby wire bondingis accurately and positively accomplished.
COPYRIGHT: (C)1978,JPO&Japio
JP12245476A 1976-10-12 1976-10-12 Assembling method of semiconductor device Pending JPS5347275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12245476A JPS5347275A (en) 1976-10-12 1976-10-12 Assembling method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12245476A JPS5347275A (en) 1976-10-12 1976-10-12 Assembling method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5347275A true JPS5347275A (en) 1978-04-27

Family

ID=14836236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12245476A Pending JPS5347275A (en) 1976-10-12 1976-10-12 Assembling method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5347275A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60203603A (en) * 1984-03-29 1985-10-15 Toyo Ink Mfg Co Ltd Method for producing high concentration emulsion polymer
US4648209A (en) * 1985-04-02 1987-03-10 Toyo Machinery Co., Ltd. Small-sized drill grinding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60203603A (en) * 1984-03-29 1985-10-15 Toyo Ink Mfg Co Ltd Method for producing high concentration emulsion polymer
US4648209A (en) * 1985-04-02 1987-03-10 Toyo Machinery Co., Ltd. Small-sized drill grinding machine

Similar Documents

Publication Publication Date Title
DE3175125D1 (en) Semiconductor memory device and method for manufacturing the same
DE3265339D1 (en) Method for manufacturing semiconductor device
DE3273569D1 (en) Semiconductor device having an electrode, and method for producing the same
JPS5755599A (en) Method and device for testing semiconductor memory
JPS51131274A (en) Tip bonding method
EP0139019A4 (en) SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD.
DE3279378D1 (en) Package for semiconductor device and method for its production
DE3278181D1 (en) Method for manufacturing semiconductor device
GB2104290B (en) Semiconductor device and method for manufacturing the same
JPS51115775A (en) Semiconductor apparatus
JPS52136862A (en) Diffusion bonding method
JPS533165A (en) Wire bonding apparatus
JPS5299451A (en) Heating time controller
JPS5372456A (en) Glass sealing semiconductor device
NL186886B (en) SEMICONDUCTOR DEVICE.
JPS5223273A (en) Method of manufacturing semiconductor element
EP0036620A3 (en) Semiconductor device and method for fabricating the same
JPS5360572A (en) Ultrasonic wire bonding device
JPS5285470A (en) Lead frame fixing jig for wire bonding
DE2961197D1 (en) Method and device for manufacturing an intermediate mounting element for semiconductor chips
JPS51118932A (en) Write-modify method of program and the device
JPS5227313A (en) Automated picture tone control photographing method and its device
FI832891A7 (en) An improved method for dissolving impure uranium tetrafluoride.
JPS5242074A (en) Detecting method of position
JPS51126062A (en) Tap short bonding method on wire bonding