JPS5372456A - Glass sealing semiconductor device - Google Patents

Glass sealing semiconductor device

Info

Publication number
JPS5372456A
JPS5372456A JP14777276A JP14777276A JPS5372456A JP S5372456 A JPS5372456 A JP S5372456A JP 14777276 A JP14777276 A JP 14777276A JP 14777276 A JP14777276 A JP 14777276A JP S5372456 A JPS5372456 A JP S5372456A
Authority
JP
Japan
Prior art keywords
semiconductor device
glass sealing
sealing semiconductor
placing
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14777276A
Other languages
Japanese (ja)
Inventor
Eiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14777276A priority Critical patent/JPS5372456A/en
Publication of JPS5372456A publication Critical patent/JPS5372456A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the sealing glass to cause cracks and to enable multi-pin configuration, by placing the lead frame with a plural number of stages toward height direction.
COPYRIGHT: (C)1978,JPO&Japio
JP14777276A 1976-12-10 1976-12-10 Glass sealing semiconductor device Pending JPS5372456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14777276A JPS5372456A (en) 1976-12-10 1976-12-10 Glass sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14777276A JPS5372456A (en) 1976-12-10 1976-12-10 Glass sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5372456A true JPS5372456A (en) 1978-06-27

Family

ID=15437822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14777276A Pending JPS5372456A (en) 1976-12-10 1976-12-10 Glass sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5372456A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126948A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Highly integrated semiconductor
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JPH0297041A (en) * 1988-10-03 1990-04-09 Nec Kyushu Ltd Ceramic package
JP2004261512A (en) * 2003-03-04 2004-09-24 Pentax Corp Solid-state image sensor, electronic endoscope
JPWO2016047130A1 (en) * 2014-09-22 2017-04-27 旭化成エレクトロニクス株式会社 Hall sensor and lens module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126948A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Highly integrated semiconductor
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JPH0297041A (en) * 1988-10-03 1990-04-09 Nec Kyushu Ltd Ceramic package
JP2004261512A (en) * 2003-03-04 2004-09-24 Pentax Corp Solid-state image sensor, electronic endoscope
JPWO2016047130A1 (en) * 2014-09-22 2017-04-27 旭化成エレクトロニクス株式会社 Hall sensor and lens module

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