JPS5354971A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5354971A
JPS5354971A JP13027176A JP13027176A JPS5354971A JP S5354971 A JPS5354971 A JP S5354971A JP 13027176 A JP13027176 A JP 13027176A JP 13027176 A JP13027176 A JP 13027176A JP S5354971 A JPS5354971 A JP S5354971A
Authority
JP
Japan
Prior art keywords
semiconductor device
provision
package
occurrence
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13027176A
Other languages
Japanese (ja)
Other versions
JPS5537103B2 (en
Inventor
Yoshiyuki Sugawa
Yoshiro Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13027176A priority Critical patent/JPS5354971A/en
Priority to US05/844,069 priority patent/US4150394A/en
Priority to DE2748567A priority patent/DE2748567C2/en
Publication of JPS5354971A publication Critical patent/JPS5354971A/en
Publication of JPS5537103B2 publication Critical patent/JPS5537103B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the occurrence of fire accidents by perfectly electrically and thermally shielding diaphragms which couple electrode bodies and package, and an element through provision of an insulation layer between both.
COPYRIGHT: (C)1978,JPO&Japio
JP13027176A 1976-10-28 1976-10-28 Semiconductor device Granted JPS5354971A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP13027176A JPS5354971A (en) 1976-10-28 1976-10-28 Semiconductor device
US05/844,069 US4150394A (en) 1976-10-28 1977-10-20 Flat package semiconductor device having high explosion preventing capacity
DE2748567A DE2748567C2 (en) 1976-10-28 1977-10-28 Power semiconductor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13027176A JPS5354971A (en) 1976-10-28 1976-10-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5354971A true JPS5354971A (en) 1978-05-18
JPS5537103B2 JPS5537103B2 (en) 1980-09-25

Family

ID=15030296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13027176A Granted JPS5354971A (en) 1976-10-28 1976-10-28 Semiconductor device

Country Status (3)

Country Link
US (1) US4150394A (en)
JP (1) JPS5354971A (en)
DE (1) DE2748567C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017506819A (en) * 2014-01-21 2017-03-09 アーベーベー・テクノロジー・アーゲー Power semiconductor device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
CH630490A5 (en) * 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie HOUSING FOR A SEMICONDUCTOR HIGH-PERFORMANCE COMPONENT.
DE2915862C2 (en) * 1979-04-19 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Semiconductor component with a disc-shaped housing
JPS5635443A (en) * 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
DE2936780C2 (en) * 1979-09-12 1985-02-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor component
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
DE3308661A1 (en) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg SEMICONDUCTOR ELEMENT
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
DE10306767A1 (en) * 2003-02-18 2004-08-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Semiconductor module, e.g. for power semiconductor applications, has insulator that is resistant to high temperatures, arranged between package wall and semiconductor device
US8183674B2 (en) * 2006-09-14 2012-05-22 Siemens Aktiengesellschaft Power semiconductor module comprising an explosion protection system
CN103635998B (en) * 2011-06-21 2016-08-17 Abb技术有限公司 There is the power semiconductor housing of contact mechanism
JP7432072B2 (en) * 2019-07-31 2024-02-16 ヒタチ・エナジー・リミテッド power semiconductor devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243246U (en) * 1975-09-19 1977-03-28
JPS52162865U (en) * 1976-06-04 1977-12-09

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
US3581160A (en) * 1968-12-23 1971-05-25 Gen Electric Semiconductor rectifier assembly having high explosion rating
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
DE2014289A1 (en) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Disc-shaped semiconductor component and method for its manufacture
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
US3975758A (en) * 1975-05-27 1976-08-17 Westinghouse Electric Corporation Gate assist turn-off, amplifying gate thyristor and a package assembly therefor
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243246U (en) * 1975-09-19 1977-03-28
JPS52162865U (en) * 1976-06-04 1977-12-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017506819A (en) * 2014-01-21 2017-03-09 アーベーベー・テクノロジー・アーゲー Power semiconductor device

Also Published As

Publication number Publication date
US4150394A (en) 1979-04-17
DE2748567C2 (en) 1983-01-13
DE2748567A1 (en) 1978-05-03
JPS5537103B2 (en) 1980-09-25

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