JPS5359366A - Semiconductor unit - Google Patents

Semiconductor unit

Info

Publication number
JPS5359366A
JPS5359366A JP13489576A JP13489576A JPS5359366A JP S5359366 A JPS5359366 A JP S5359366A JP 13489576 A JP13489576 A JP 13489576A JP 13489576 A JP13489576 A JP 13489576A JP S5359366 A JPS5359366 A JP S5359366A
Authority
JP
Japan
Prior art keywords
semiconductor unit
solder
solder materials
pellets
projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13489576A
Other languages
Japanese (ja)
Inventor
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13489576A priority Critical patent/JPS5359366A/en
Publication of JPS5359366A publication Critical patent/JPS5359366A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To make solder materials into a desired thickness and reduce fatigue degree of solder materials by providing more than three projections on the solder contact face of pellets.
COPYRIGHT: (C)1978,JPO&Japio
JP13489576A 1976-11-09 1976-11-09 Semiconductor unit Pending JPS5359366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13489576A JPS5359366A (en) 1976-11-09 1976-11-09 Semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13489576A JPS5359366A (en) 1976-11-09 1976-11-09 Semiconductor unit

Publications (1)

Publication Number Publication Date
JPS5359366A true JPS5359366A (en) 1978-05-29

Family

ID=15139020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13489576A Pending JPS5359366A (en) 1976-11-09 1976-11-09 Semiconductor unit

Country Status (1)

Country Link
JP (1) JPS5359366A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618434A (en) * 1979-07-24 1981-02-21 Shindengen Electric Mfg Co Ltd Semiconductor device
JPS59195735U (en) * 1983-06-13 1984-12-26 スタンレー電気株式会社 Solder pellet fixing structure on mount base
JP2010040651A (en) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd Semiconductor device and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618434A (en) * 1979-07-24 1981-02-21 Shindengen Electric Mfg Co Ltd Semiconductor device
JPS59195735U (en) * 1983-06-13 1984-12-26 スタンレー電気株式会社 Solder pellet fixing structure on mount base
JP2010040651A (en) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd Semiconductor device and method of manufacturing the same

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