JPS5366171A - Production of semiconductor unit - Google Patents

Production of semiconductor unit

Info

Publication number
JPS5366171A
JPS5366171A JP14127776A JP14127776A JPS5366171A JP S5366171 A JPS5366171 A JP S5366171A JP 14127776 A JP14127776 A JP 14127776A JP 14127776 A JP14127776 A JP 14127776A JP S5366171 A JPS5366171 A JP S5366171A
Authority
JP
Japan
Prior art keywords
production
semiconductor unit
lead part
resin
chemicalproof
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14127776A
Other languages
Japanese (ja)
Inventor
Usuke Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14127776A priority Critical patent/JPS5366171A/en
Publication of JPS5366171A publication Critical patent/JPS5366171A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve a soldering efficiency by exfoliating a lead part after mouted wiring resin sealing of pellets under the state where only the lead part is covered with heatproof and chemicalproof resin.
JP14127776A 1976-11-26 1976-11-26 Production of semiconductor unit Pending JPS5366171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14127776A JPS5366171A (en) 1976-11-26 1976-11-26 Production of semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14127776A JPS5366171A (en) 1976-11-26 1976-11-26 Production of semiconductor unit

Publications (1)

Publication Number Publication Date
JPS5366171A true JPS5366171A (en) 1978-06-13

Family

ID=15288139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14127776A Pending JPS5366171A (en) 1976-11-26 1976-11-26 Production of semiconductor unit

Country Status (1)

Country Link
JP (1) JPS5366171A (en)

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