JPS5240067A - Resin molded type semiconductor device - Google Patents

Resin molded type semiconductor device

Info

Publication number
JPS5240067A
JPS5240067A JP11561475A JP11561475A JPS5240067A JP S5240067 A JPS5240067 A JP S5240067A JP 11561475 A JP11561475 A JP 11561475A JP 11561475 A JP11561475 A JP 11561475A JP S5240067 A JPS5240067 A JP S5240067A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
resin molded
molded type
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11561475A
Other languages
Japanese (ja)
Inventor
Eiichi Yamada
Akira Suzuki
Tokio Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11561475A priority Critical patent/JPS5240067A/en
Publication of JPS5240067A publication Critical patent/JPS5240067A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: A resin molded type semiconductor device which does not cause corrosion of electrodes and wiring layers is obtained.
COPYRIGHT: (C)1977,JPO&Japio
JP11561475A 1975-09-26 1975-09-26 Resin molded type semiconductor device Pending JPS5240067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11561475A JPS5240067A (en) 1975-09-26 1975-09-26 Resin molded type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11561475A JPS5240067A (en) 1975-09-26 1975-09-26 Resin molded type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5240067A true JPS5240067A (en) 1977-03-28

Family

ID=14667000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11561475A Pending JPS5240067A (en) 1975-09-26 1975-09-26 Resin molded type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5240067A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045918A (en) * 1986-12-19 1991-09-03 North American Philips Corp. Semiconductor device with reduced packaging stress
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress

Similar Documents

Publication Publication Date Title
JPS5211767A (en) Semiconductor device
JPS5240067A (en) Resin molded type semiconductor device
JPS534472A (en) Semiconductor package
JPS5372570A (en) Manufacture of semiconductor device
JPS5216166A (en) Semiconductor device
JPS5375762A (en) Semiconductor device
JPS542667A (en) Manufacture of semiconductor device
JPS5223273A (en) Method of manufacturing semiconductor element
JPS51118965A (en) Insulation film of semiconductor device
JPS5212572A (en) Semi-conductor device
JPS51123086A (en) Semicanductor device and its production process
JPS51112279A (en) Semiconductor device
JPS5240061A (en) Semiconductor device and process for production of same
JPS51117575A (en) Electronic circuit and its manufacturing method
JPS5240066A (en) Resin mold type semiconductor device
JPS5345174A (en) Moisture resistant semiconductor device
JPS5227360A (en) Resin seal-type semiconductor unit
JPS5325363A (en) Semiconductor element
JPS5237767A (en) Semiconductor device
JPS529984A (en) Drying device
JPS5211772A (en) Semiconductor device
JPS51147288A (en) Semiconductor device
JPS51114833A (en) Bubble memory device
JPS51151089A (en) Manufacturing method of a semiconductor
JPS5377171A (en) Production of semiconductor device