JPS5384556A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5384556A
JPS5384556A JP16032076A JP16032076A JPS5384556A JP S5384556 A JPS5384556 A JP S5384556A JP 16032076 A JP16032076 A JP 16032076A JP 16032076 A JP16032076 A JP 16032076A JP S5384556 A JPS5384556 A JP S5384556A
Authority
JP
Japan
Prior art keywords
semiconductor device
electrodes
hours
performance
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16032076A
Other languages
Japanese (ja)
Inventor
Tsutomu Kamei
Tsutomu Nagahama
Hiromoto Yamawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16032076A priority Critical patent/JPS5384556A/en
Publication of JPS5384556A publication Critical patent/JPS5384556A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce man-hours and to improve the performance, by connecting the element electrodes and the package electrodes with metallic foil of comb shape.
COPYRIGHT: (C)1978,JPO&Japio
JP16032076A 1976-12-29 1976-12-29 Semiconductor device Pending JPS5384556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16032076A JPS5384556A (en) 1976-12-29 1976-12-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16032076A JPS5384556A (en) 1976-12-29 1976-12-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5384556A true JPS5384556A (en) 1978-07-26

Family

ID=15712396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16032076A Pending JPS5384556A (en) 1976-12-29 1976-12-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5384556A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866640U (en) * 1981-10-29 1983-05-06 新電元工業株式会社 semiconductor equipment
JPH0439946A (en) * 1990-06-05 1992-02-10 Mitsubishi Electric Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866640U (en) * 1981-10-29 1983-05-06 新電元工業株式会社 semiconductor equipment
JPH0439946A (en) * 1990-06-05 1992-02-10 Mitsubishi Electric Corp Semiconductor device

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