JPS5372584A - Circuit element - Google Patents

Circuit element

Info

Publication number
JPS5372584A
JPS5372584A JP14884876A JP14884876A JPS5372584A JP S5372584 A JPS5372584 A JP S5372584A JP 14884876 A JP14884876 A JP 14884876A JP 14884876 A JP14884876 A JP 14884876A JP S5372584 A JPS5372584 A JP S5372584A
Authority
JP
Japan
Prior art keywords
circuit element
groove
type
inductor
securing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14884876A
Other languages
Japanese (ja)
Inventor
Kazuo Kusunoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14884876A priority Critical patent/JPS5372584A/en
Publication of JPS5372584A publication Critical patent/JPS5372584A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce the dispersion of the inductance value for the circuit element which is used for a high frequency mixture integrated circuit, by securing an inductor by the following procedure: a groove is formed on a semiconductor substrate surface; the surface is covered with an oxide film; and a belt-type or bar-type metal conductor is provided on and along the groove to be fixed to the substrate only at the both ends.
JP14884876A 1976-12-10 1976-12-10 Circuit element Pending JPS5372584A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14884876A JPS5372584A (en) 1976-12-10 1976-12-10 Circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14884876A JPS5372584A (en) 1976-12-10 1976-12-10 Circuit element

Publications (1)

Publication Number Publication Date
JPS5372584A true JPS5372584A (en) 1978-06-28

Family

ID=15462080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14884876A Pending JPS5372584A (en) 1976-12-10 1976-12-10 Circuit element

Country Status (1)

Country Link
JP (1) JPS5372584A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677407A (en) * 1992-04-06 1994-03-18 Nippon Precision Circuits Kk Semiconductor device
JP2003051546A (en) * 2001-08-03 2003-02-21 Sony Corp Semiconductor device and semiconductor manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677407A (en) * 1992-04-06 1994-03-18 Nippon Precision Circuits Kk Semiconductor device
JP2003051546A (en) * 2001-08-03 2003-02-21 Sony Corp Semiconductor device and semiconductor manufacturing method

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