JPS5373974A - Heat dissipating construction for semiconductor device - Google Patents

Heat dissipating construction for semiconductor device

Info

Publication number
JPS5373974A
JPS5373974A JP10061276A JP10061276A JPS5373974A JP S5373974 A JPS5373974 A JP S5373974A JP 10061276 A JP10061276 A JP 10061276A JP 10061276 A JP10061276 A JP 10061276A JP S5373974 A JPS5373974 A JP S5373974A
Authority
JP
Japan
Prior art keywords
heat dissipating
semiconductor device
dissipating construction
mounting
construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10061276A
Other languages
Japanese (ja)
Inventor
Kenryo Kawada
Hiroshi Hososaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10061276A priority Critical patent/JPS5373974A/en
Publication of JPS5373974A publication Critical patent/JPS5373974A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain the heat dissipating part having a compact construction, by mounting the semiconductor pellet on the heat dissipating material having similar thermal conductivity and coefficient of expansion to the pellet and further by mounting it on the ceramic plate indirectly.
COPYRIGHT: (C)1978,JPO&Japio
JP10061276A 1976-08-25 1976-08-25 Heat dissipating construction for semiconductor device Pending JPS5373974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10061276A JPS5373974A (en) 1976-08-25 1976-08-25 Heat dissipating construction for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10061276A JPS5373974A (en) 1976-08-25 1976-08-25 Heat dissipating construction for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5373974A true JPS5373974A (en) 1978-06-30

Family

ID=14278658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10061276A Pending JPS5373974A (en) 1976-08-25 1976-08-25 Heat dissipating construction for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5373974A (en)

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