JPS5374367A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5374367A
JPS5374367A JP15107776A JP15107776A JPS5374367A JP S5374367 A JPS5374367 A JP S5374367A JP 15107776 A JP15107776 A JP 15107776A JP 15107776 A JP15107776 A JP 15107776A JP S5374367 A JPS5374367 A JP S5374367A
Authority
JP
Japan
Prior art keywords
concavity
providing
semiconductor device
thickness
solder material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15107776A
Other languages
Japanese (ja)
Inventor
Toshiyuki Fujii
Takashi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15107776A priority Critical patent/JPS5374367A/en
Publication of JPS5374367A publication Critical patent/JPS5374367A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE: To control the thickness of the solder material and thus to obtain a good heating cycle and electrical performance, by providing a concavity whose appearance shape is a little smaller than the binding surface of the semiconductor substrate onto the upper surface of the bonding part of the electrode substrate and also providing parallel and thin grooves at the area within the concavity.
COPYRIGHT: (C)1978,JPO&Japio
JP15107776A 1976-12-15 1976-12-15 Semiconductor device Pending JPS5374367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15107776A JPS5374367A (en) 1976-12-15 1976-12-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15107776A JPS5374367A (en) 1976-12-15 1976-12-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5374367A true JPS5374367A (en) 1978-07-01

Family

ID=15510797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15107776A Pending JPS5374367A (en) 1976-12-15 1976-12-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5374367A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211972A (en) * 1986-03-13 1987-09-17 Oki Electric Ind Co Ltd Manufacture of optical print head
JP2018067613A (en) * 2016-10-19 2018-04-26 三菱電機株式会社 DIE PAD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
JP2019186354A (en) * 2018-04-09 2019-10-24 三菱マテリアル株式会社 Manufacturing method of ceramic-metal junction body, manufacturing method of multi-piece ceramic-metal junction body, ceramic-metal junction body and multi-piece ceramic-metal junction body
JP2024143284A (en) * 2023-03-30 2024-10-11 株式会社デンソー Semiconductor device and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211972A (en) * 1986-03-13 1987-09-17 Oki Electric Ind Co Ltd Manufacture of optical print head
JP2018067613A (en) * 2016-10-19 2018-04-26 三菱電機株式会社 DIE PAD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
JP2019186354A (en) * 2018-04-09 2019-10-24 三菱マテリアル株式会社 Manufacturing method of ceramic-metal junction body, manufacturing method of multi-piece ceramic-metal junction body, ceramic-metal junction body and multi-piece ceramic-metal junction body
JP2024143284A (en) * 2023-03-30 2024-10-11 株式会社デンソー Semiconductor device and its manufacturing method

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