JPS5227357A - Manufacturing process of semiconductor unit - Google Patents

Manufacturing process of semiconductor unit

Info

Publication number
JPS5227357A
JPS5227357A JP50103023A JP10302375A JPS5227357A JP S5227357 A JPS5227357 A JP S5227357A JP 50103023 A JP50103023 A JP 50103023A JP 10302375 A JP10302375 A JP 10302375A JP S5227357 A JPS5227357 A JP S5227357A
Authority
JP
Japan
Prior art keywords
manufacturing process
semiconductor unit
ensured
rear surface
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50103023A
Other languages
Japanese (ja)
Inventor
Shinji Shirase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50103023A priority Critical patent/JPS5227357A/en
Publication of JPS5227357A publication Critical patent/JPS5227357A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: The semiconductor layer of single element is formed on the rear surface of a compound semiconductor substrate and then attached to external lead-out electrode by thermo compression bonding via gold leaf. In this way, an easy electrode attachment is ensured.
COPYRIGHT: (C)1977,JPO&Japio
JP50103023A 1975-08-27 1975-08-27 Manufacturing process of semiconductor unit Pending JPS5227357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50103023A JPS5227357A (en) 1975-08-27 1975-08-27 Manufacturing process of semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50103023A JPS5227357A (en) 1975-08-27 1975-08-27 Manufacturing process of semiconductor unit

Publications (1)

Publication Number Publication Date
JPS5227357A true JPS5227357A (en) 1977-03-01

Family

ID=14343033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50103023A Pending JPS5227357A (en) 1975-08-27 1975-08-27 Manufacturing process of semiconductor unit

Country Status (1)

Country Link
JP (1) JPS5227357A (en)

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