JPS5378165A - Cutting method for semiconductor substrate - Google Patents

Cutting method for semiconductor substrate

Info

Publication number
JPS5378165A
JPS5378165A JP15471476A JP15471476A JPS5378165A JP S5378165 A JPS5378165 A JP S5378165A JP 15471476 A JP15471476 A JP 15471476A JP 15471476 A JP15471476 A JP 15471476A JP S5378165 A JPS5378165 A JP S5378165A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
cutting method
substrate
cutting
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15471476A
Other languages
Japanese (ja)
Inventor
Akira Kuromaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15471476A priority Critical patent/JPS5378165A/en
Publication of JPS5378165A publication Critical patent/JPS5378165A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To prevent contamination of substrate and to cool the cutter, by cutting the substrate with immersed substrate in water.
COPYRIGHT: (C)1978,JPO&Japio
JP15471476A 1976-12-22 1976-12-22 Cutting method for semiconductor substrate Pending JPS5378165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15471476A JPS5378165A (en) 1976-12-22 1976-12-22 Cutting method for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15471476A JPS5378165A (en) 1976-12-22 1976-12-22 Cutting method for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5378165A true JPS5378165A (en) 1978-07-11

Family

ID=15590347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15471476A Pending JPS5378165A (en) 1976-12-22 1976-12-22 Cutting method for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5378165A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04180651A (en) * 1990-11-15 1992-06-26 Nec Kyushu Ltd Manufacture of semiconductor device
US7692440B2 (en) * 2002-10-29 2010-04-06 Advanced Systems Automation Limited Handler for semiconductor singulation and method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04180651A (en) * 1990-11-15 1992-06-26 Nec Kyushu Ltd Manufacture of semiconductor device
US7692440B2 (en) * 2002-10-29 2010-04-06 Advanced Systems Automation Limited Handler for semiconductor singulation and method therefor

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