JPS5378173A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5378173A
JPS5378173A JP15471676A JP15471676A JPS5378173A JP S5378173 A JPS5378173 A JP S5378173A JP 15471676 A JP15471676 A JP 15471676A JP 15471676 A JP15471676 A JP 15471676A JP S5378173 A JPS5378173 A JP S5378173A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
characterstics
wafer
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15471676A
Other languages
Japanese (ja)
Other versions
JPS546867B2 (en
Inventor
Kazumi Unno
Teruo Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15471676A priority Critical patent/JPS5378173A/en
Publication of JPS5378173A publication Critical patent/JPS5378173A/en
Publication of JPS546867B2 publication Critical patent/JPS546867B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: A wafer is adhered to a sheet by using conductive adhesives and split, and on a basis of measured values of characterstics of respective elements, some are selectively picked up, thereby performing the mounting.
COPYRIGHT: (C)1978,JPO&Japio
JP15471676A 1976-12-22 1976-12-22 Manufacture of semiconductor device Granted JPS5378173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15471676A JPS5378173A (en) 1976-12-22 1976-12-22 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15471676A JPS5378173A (en) 1976-12-22 1976-12-22 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5378173A true JPS5378173A (en) 1978-07-11
JPS546867B2 JPS546867B2 (en) 1979-04-02

Family

ID=15590393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15471676A Granted JPS5378173A (en) 1976-12-22 1976-12-22 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5378173A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169921A (en) * 1982-03-08 1983-10-06 Hitachi Chem Co Ltd Energizing inspection for p-n junction semiconductor element
JPS63178333U (en) * 1987-05-09 1988-11-18
WO2006028040A1 (en) * 2004-09-06 2006-03-16 Tokyo Electron Limited Wafer chuck
JP2008227080A (en) * 2007-03-12 2008-09-25 Sharp Corp Concentrating solar cell manufacturing method and electrical characteristic measuring apparatus
JP2012023229A (en) * 2010-07-15 2012-02-02 Mitsubishi Electric Corp Semiconductor device characteristic measurement method and semiconductor device manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169921A (en) * 1982-03-08 1983-10-06 Hitachi Chem Co Ltd Energizing inspection for p-n junction semiconductor element
JPS63178333U (en) * 1987-05-09 1988-11-18
WO2006028040A1 (en) * 2004-09-06 2006-03-16 Tokyo Electron Limited Wafer chuck
US7411384B2 (en) 2004-09-06 2008-08-12 Tokyo Electron Limited Wafer chuck
JP2008227080A (en) * 2007-03-12 2008-09-25 Sharp Corp Concentrating solar cell manufacturing method and electrical characteristic measuring apparatus
JP2012023229A (en) * 2010-07-15 2012-02-02 Mitsubishi Electric Corp Semiconductor device characteristic measurement method and semiconductor device manufacturing method

Also Published As

Publication number Publication date
JPS546867B2 (en) 1979-04-02

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