JPS5379464A - Method of producing circuit - Google Patents

Method of producing circuit

Info

Publication number
JPS5379464A
JPS5379464A JP15675176A JP15675176A JPS5379464A JP S5379464 A JPS5379464 A JP S5379464A JP 15675176 A JP15675176 A JP 15675176A JP 15675176 A JP15675176 A JP 15675176A JP S5379464 A JPS5379464 A JP S5379464A
Authority
JP
Japan
Prior art keywords
producing circuit
producing
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15675176A
Other languages
Japanese (ja)
Inventor
Masahiro Fujimori
Sanenobu Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP15675176A priority Critical patent/JPS5379464A/en
Priority to CH1449077A priority patent/CH623183A5/en
Publication of JPS5379464A publication Critical patent/JPS5379464A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Wire Bonding (AREA)
JP15675176A 1976-11-26 1976-12-24 Method of producing circuit Pending JPS5379464A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15675176A JPS5379464A (en) 1976-12-24 1976-12-24 Method of producing circuit
CH1449077A CH623183A5 (en) 1976-11-26 1977-11-25 Circuit board and method for its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15675176A JPS5379464A (en) 1976-12-24 1976-12-24 Method of producing circuit

Publications (1)

Publication Number Publication Date
JPS5379464A true JPS5379464A (en) 1978-07-13

Family

ID=15634513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15675176A Pending JPS5379464A (en) 1976-11-26 1976-12-24 Method of producing circuit

Country Status (1)

Country Link
JP (1) JPS5379464A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291128A (en) * 1986-06-11 1987-12-17 Nec Corp Hybrid integrated circuit device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925983A (en) * 1972-04-11 1974-03-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4925983A (en) * 1972-04-11 1974-03-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291128A (en) * 1986-06-11 1987-12-17 Nec Corp Hybrid integrated circuit device

Similar Documents

Publication Publication Date Title
JPS5343021A (en) Method of producing molybdenummiron
CS191329B2 (en) Method of producing m-phenoxybenzaldehyde
JPS52110498A (en) Method of manufacturing thckkfilm circuit
JPS52140870A (en) Method of producing circuit substrate
JPS5336391A (en) Method of producing can
JPS5355774A (en) Method of producing multiiwire circuit board
JPS52109159A (en) Method of producing thick circuit substrate
JPS52155357A (en) Method of making electronic parts
JPS5341768A (en) Method of producing circuit substrate
JPS5318414A (en) Method of producing tangstennbased parts
JPS5376355A (en) Method of making electronic parts
JPS5379464A (en) Method of producing circuit
JPS5310062A (en) Method of producing bothhside printed circuit
JPS52128380A (en) Method of producing 22chloronicotinamides
JPS5378229A (en) Method of producing canthaxanthene
JPS5381966A (en) Method of producing electric circuit part
JPS52120084A (en) Method of producing can
JPS52133571A (en) Method of producing hybric integrated circuit
JPS5310063A (en) Method of producing circuit
JPS5363575A (en) Method of producing circuit board
JPS5333367A (en) Method of producing circuit connector
JPS5366572A (en) Method of producing circuit unit
JPS5245057A (en) Method of producing hybrid circuit
JPS52122314A (en) Method of producing 33deoxyy33iodooddglucose
JPS52131511A (en) Method of producing 33deoxyy33iodooddglucose