JPS5383574A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5383574A
JPS5383574A JP15813976A JP15813976A JPS5383574A JP S5383574 A JPS5383574 A JP S5383574A JP 15813976 A JP15813976 A JP 15813976A JP 15813976 A JP15813976 A JP 15813976A JP S5383574 A JPS5383574 A JP S5383574A
Authority
JP
Japan
Prior art keywords
wafer
manufacture
semiconductor device
securing
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15813976A
Other languages
Japanese (ja)
Inventor
Tomihisa Yamada
Takahiko Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15813976A priority Critical patent/JPS5383574A/en
Publication of JPS5383574A publication Critical patent/JPS5383574A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To ensure an easy mask matching, by securing short protrusions along the wafer surface at the prescribed areas inside the circular reinforcement layer made of poly crystal Si, etc. which is provided at the circumference of the Si wafer and also by securing notches to be matched with the above protrusions to the pattern mask which is to be put onto the wafer.
COPYRIGHT: (C)1978,JPO&Japio
JP15813976A 1976-12-29 1976-12-29 Manufacture of semiconductor device Pending JPS5383574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15813976A JPS5383574A (en) 1976-12-29 1976-12-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15813976A JPS5383574A (en) 1976-12-29 1976-12-29 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5383574A true JPS5383574A (en) 1978-07-24

Family

ID=15665111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15813976A Pending JPS5383574A (en) 1976-12-29 1976-12-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5383574A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607120A (en) * 1983-06-25 1985-01-14 Rohm Co Ltd Method for positioning semiconductor wafer
JPH03111923U (en) * 1990-03-01 1991-11-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607120A (en) * 1983-06-25 1985-01-14 Rohm Co Ltd Method for positioning semiconductor wafer
JPH03111923U (en) * 1990-03-01 1991-11-15

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