JPS5385164A - Assembing method of semiconductor device - Google Patents

Assembing method of semiconductor device

Info

Publication number
JPS5385164A
JPS5385164A JP66477A JP66477A JPS5385164A JP S5385164 A JPS5385164 A JP S5385164A JP 66477 A JP66477 A JP 66477A JP 66477 A JP66477 A JP 66477A JP S5385164 A JPS5385164 A JP S5385164A
Authority
JP
Japan
Prior art keywords
assembing
semiconductor device
load
decreasing
reduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP66477A
Other languages
Japanese (ja)
Other versions
JPS5845826B2 (en
Inventor
Yoshisada Yoneda
Hajime Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP66477A priority Critical patent/JPS5845826B2/en
Publication of JPS5385164A publication Critical patent/JPS5385164A/en
Publication of JPS5845826B2 publication Critical patent/JPS5845826B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To make possible the reduction in the holding strength of the structural parts of a device by increasing compression bonding load once to a large load point P1 to improve the mutual fitting of contact faces, then decreasing said load.
COPYRIGHT: (C)1978,JPO&Japio
JP66477A 1977-01-06 1977-01-06 How to assemble semiconductor devices Expired JPS5845826B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP66477A JPS5845826B2 (en) 1977-01-06 1977-01-06 How to assemble semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP66477A JPS5845826B2 (en) 1977-01-06 1977-01-06 How to assemble semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5385164A true JPS5385164A (en) 1978-07-27
JPS5845826B2 JPS5845826B2 (en) 1983-10-12

Family

ID=11479986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP66477A Expired JPS5845826B2 (en) 1977-01-06 1977-01-06 How to assemble semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5845826B2 (en)

Also Published As

Publication number Publication date
JPS5845826B2 (en) 1983-10-12

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