JPS5388568A - Laser scribing apparatus - Google Patents

Laser scribing apparatus

Info

Publication number
JPS5388568A
JPS5388568A JP340377A JP340377A JPS5388568A JP S5388568 A JPS5388568 A JP S5388568A JP 340377 A JP340377 A JP 340377A JP 340377 A JP340377 A JP 340377A JP S5388568 A JPS5388568 A JP S5388568A
Authority
JP
Japan
Prior art keywords
laser scribing
scribing apparatus
semiconductor
scribing
splashes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP340377A
Other languages
Japanese (ja)
Inventor
Sokichi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP340377A priority Critical patent/JPS5388568A/en
Publication of JPS5388568A publication Critical patent/JPS5388568A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To eliminate the need for cleaning treatment after letting the splashes on the front side of a semiconductor melted by laser beams fall down by holding the surface of a semiconductor wafer facing downward, dividing the laser beam for scribing in two directions and radiating one to the front and the other to the back.
JP340377A 1977-01-13 1977-01-13 Laser scribing apparatus Pending JPS5388568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP340377A JPS5388568A (en) 1977-01-13 1977-01-13 Laser scribing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP340377A JPS5388568A (en) 1977-01-13 1977-01-13 Laser scribing apparatus

Publications (1)

Publication Number Publication Date
JPS5388568A true JPS5388568A (en) 1978-08-04

Family

ID=11556402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP340377A Pending JPS5388568A (en) 1977-01-13 1977-01-13 Laser scribing apparatus

Country Status (1)

Country Link
JP (1) JPS5388568A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127743A (en) * 1983-12-14 1985-07-08 Toshiba Corp Laser scribing method
JP2001179473A (en) * 1999-12-24 2001-07-03 Semiconductor Energy Lab Co Ltd Laser device, method for cutting substrate using laser beam, and method for manufacturing semiconductor device
JP2003124154A (en) * 2001-10-15 2003-04-25 Shinko Electric Ind Co Ltd Method for forming holes in silicon substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127743A (en) * 1983-12-14 1985-07-08 Toshiba Corp Laser scribing method
JP2001179473A (en) * 1999-12-24 2001-07-03 Semiconductor Energy Lab Co Ltd Laser device, method for cutting substrate using laser beam, and method for manufacturing semiconductor device
JP2003124154A (en) * 2001-10-15 2003-04-25 Shinko Electric Ind Co Ltd Method for forming holes in silicon substrate

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