JPS5394875A - Package for semiconductor element - Google Patents

Package for semiconductor element

Info

Publication number
JPS5394875A
JPS5394875A JP991077A JP991077A JPS5394875A JP S5394875 A JPS5394875 A JP S5394875A JP 991077 A JP991077 A JP 991077A JP 991077 A JP991077 A JP 991077A JP S5394875 A JPS5394875 A JP S5394875A
Authority
JP
Japan
Prior art keywords
package
semiconductor element
feqturing
dectease
detouring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP991077A
Other languages
English (en)
Other versions
JPS6011462B2 (ja
Inventor
Zensuke Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52009910A priority Critical patent/JPS6011462B2/ja
Publication of JPS5394875A publication Critical patent/JPS5394875A/ja
Publication of JPS6011462B2 publication Critical patent/JPS6011462B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP52009910A 1977-01-31 1977-01-31 半導体装置 Expired JPS6011462B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52009910A JPS6011462B2 (ja) 1977-01-31 1977-01-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52009910A JPS6011462B2 (ja) 1977-01-31 1977-01-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS5394875A true JPS5394875A (en) 1978-08-19
JPS6011462B2 JPS6011462B2 (ja) 1985-03-26

Family

ID=11733253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52009910A Expired JPS6011462B2 (ja) 1977-01-31 1977-01-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS6011462B2 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110063A (ja) * 1981-12-23 1983-06-30 Nec Corp 集積回路装置
JPS593960A (ja) * 1982-06-29 1984-01-10 Toshiba Corp 半導体装置
JPS625649A (ja) * 1985-07-01 1987-01-12 Nec Ic Microcomput Syst Ltd 集積回路パツケ−ジ
JPS6314438A (ja) * 1986-07-04 1988-01-21 Mitsubishi Electric Corp 半導体装置
JPH02131357U (ja) * 1989-04-05 1990-10-31
JPH03263334A (ja) * 1990-03-13 1991-11-22 Toshiba Corp 樹脂封止型半導体装置
JPH04177846A (ja) * 1990-11-13 1992-06-25 Toshiba Corp 半導体装置
JPH0521692A (ja) * 1991-12-05 1993-01-29 Hitachi Ltd 半導体装置
JPH0521691A (ja) * 1991-12-05 1993-01-29 Hitachi Ltd 半導体装置及びその組立方法
JPH0536890A (ja) * 1991-12-05 1993-02-12 Hitachi Ltd 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232682A (ja) * 1985-08-03 1987-02-12 株式会社　ニフコ 三次元回路構造体における集積密度向上方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110063A (ja) * 1981-12-23 1983-06-30 Nec Corp 集積回路装置
JPS593960A (ja) * 1982-06-29 1984-01-10 Toshiba Corp 半導体装置
JPS625649A (ja) * 1985-07-01 1987-01-12 Nec Ic Microcomput Syst Ltd 集積回路パツケ−ジ
JPS6314438A (ja) * 1986-07-04 1988-01-21 Mitsubishi Electric Corp 半導体装置
JPH02131357U (ja) * 1989-04-05 1990-10-31
JPH03263334A (ja) * 1990-03-13 1991-11-22 Toshiba Corp 樹脂封止型半導体装置
JPH04177846A (ja) * 1990-11-13 1992-06-25 Toshiba Corp 半導体装置
JPH0521692A (ja) * 1991-12-05 1993-01-29 Hitachi Ltd 半導体装置
JPH0521691A (ja) * 1991-12-05 1993-01-29 Hitachi Ltd 半導体装置及びその組立方法
JPH0536890A (ja) * 1991-12-05 1993-02-12 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6011462B2 (ja) 1985-03-26

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