JPS54121237A - Electroplating - Google Patents
ElectroplatingInfo
- Publication number
- JPS54121237A JPS54121237A JP2883978A JP2883978A JPS54121237A JP S54121237 A JPS54121237 A JP S54121237A JP 2883978 A JP2883978 A JP 2883978A JP 2883978 A JP2883978 A JP 2883978A JP S54121237 A JPS54121237 A JP S54121237A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- uniform
- sponge
- plating
- sponge material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 3
- 239000008151 electrolyte solution Substances 0.000 abstract 2
- 230000000994 depressogenic effect Effects 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 238000009827 uniform distribution Methods 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: In elecrroplating of complicated shaped objects, a plating-solution-imprgnated, specifically-shaped, sponge-type member is pressed on the object, thereby supplying uniform ions on the total area to easily provide uniform plating layer on the surface of the complicate object.
CONSTITUTION: Porous, flexible sponge material 2 is impregnated with electrolytic solution, and fixed on the electrode 1 (or may be fixed on the surface to be plated). The sponge material 2 is then pressed against the complicated object 3 to be plated. The sponge material is preliminarily shsped into the similar configuration to the object to be plated. When current is passed across the electrodes 1 and 3, uniform plating layer is formed on even depressed portion 31, due to uniform distribution of electrolytic solution caused by sponge-impregnated solution. For thick plating, the electrodes are vetically reciprocated while passing current so that pressing and opening is repeated. Thus, multilevel surface can be plated with uniform thick metal layer.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2883978A JPS54121237A (en) | 1978-03-14 | 1978-03-14 | Electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2883978A JPS54121237A (en) | 1978-03-14 | 1978-03-14 | Electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54121237A true JPS54121237A (en) | 1979-09-20 |
| JPS5736992B2 JPS5736992B2 (en) | 1982-08-06 |
Family
ID=12259529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2883978A Granted JPS54121237A (en) | 1978-03-14 | 1978-03-14 | Electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54121237A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
| US7513986B2 (en) * | 2001-06-14 | 2009-04-07 | Mtu Aero Engines Gmbh | Method and device for locally removing coating from parts |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240182U (en) * | 1975-09-12 | 1977-03-22 | ||
| JPS5250735A (en) * | 1975-10-22 | 1977-04-23 | Sumitomo Electric Ind Ltd | Connecting light transmitting fibers |
-
1978
- 1978-03-14 JP JP2883978A patent/JPS54121237A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240182U (en) * | 1975-09-12 | 1977-03-22 | ||
| JPS5250735A (en) * | 1975-10-22 | 1977-04-23 | Sumitomo Electric Ind Ltd | Connecting light transmitting fibers |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
| US6913681B2 (en) * | 1999-02-10 | 2005-07-05 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
| US7575664B2 (en) | 1999-02-10 | 2009-08-18 | Kabushiki Kaisha Toshiba | Plating method |
| US7513986B2 (en) * | 2001-06-14 | 2009-04-07 | Mtu Aero Engines Gmbh | Method and device for locally removing coating from parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5736992B2 (en) | 1982-08-06 |
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