JPS579894A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS579894A
JPS579894A JP8227380A JP8227380A JPS579894A JP S579894 A JPS579894 A JP S579894A JP 8227380 A JP8227380 A JP 8227380A JP 8227380 A JP8227380 A JP 8227380A JP S579894 A JPS579894 A JP S579894A
Authority
JP
Japan
Prior art keywords
plating
pipe
good
masking jig
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8227380A
Other languages
Japanese (ja)
Inventor
Koichi Ishii
Masaru Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OSAKI KINZOKU KK
Original Assignee
OSAKI KINZOKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OSAKI KINZOKU KK filed Critical OSAKI KINZOKU KK
Priority to JP8227380A priority Critical patent/JPS579894A/en
Publication of JPS579894A publication Critical patent/JPS579894A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To partially plate a metal having good adhesiveness and good quality with good accuracy by pressing a special masking jig containing electrodes therein to a body to be plated, and conducting electricity while flowing a plating soln. to the inside of the masking jig.
CONSTITUTION: A masking jig 2 having an inside pipe 3 and an inside pipe 4 and using an electrical insulator material is pressed and touched to the plating part of a body 1 to be plated by way of a packing 6. The body 1 is supported by a supporting table 8 in a manner as to leave no spacings by way of a plastic object 7. An electrode 5 is provided near the tip end of the jig 2 and is used as the counter electrode for the body 1. Various kinds of pretreating solns., a plating soln. or rinsing water is introduced from a storage tank through the pipe 4 onto the plating surface, thence it is returned into the storage tank through the pipe 3. Thereby, the partial plating is accomplished economically with good productivity.
COPYRIGHT: (C)1982,JPO&Japio
JP8227380A 1980-06-18 1980-06-18 Partial plating method Pending JPS579894A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8227380A JPS579894A (en) 1980-06-18 1980-06-18 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8227380A JPS579894A (en) 1980-06-18 1980-06-18 Partial plating method

Publications (1)

Publication Number Publication Date
JPS579894A true JPS579894A (en) 1982-01-19

Family

ID=13769871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8227380A Pending JPS579894A (en) 1980-06-18 1980-06-18 Partial plating method

Country Status (1)

Country Link
JP (1) JPS579894A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032234A (en) * 1988-12-20 1991-07-16 Minolta Camera Kabushiki Kaisha Process for plating a printed circuit board
KR20030083905A (en) * 2002-04-23 2003-11-01 (주)에스티디 Method And Apparatus For Partial Plating On A Surface Or A Section Of Pure Metal Or Alloys
EP2085503A1 (en) * 2008-01-31 2009-08-05 HDO -Druckguss- und Oberflächentechnik GmbH Method and device for producing components
JP2009270182A (en) * 2008-05-12 2009-11-19 Suzuki Motor Corp Plating treatment line
JP4828417B2 (en) * 2003-06-27 2011-11-30 ラム リサーチ コーポレーション Electroplating equipment
WO2021177035A1 (en) * 2020-03-02 2021-09-10 東京エレクトロン株式会社 Plating treatment device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508025A (en) * 1973-05-25 1975-01-28
JPS5125434A (en) * 1974-08-28 1976-03-02 Inoue Japax Res RENZOKUMET SUKISOCHI
JPS5126642A (en) * 1974-08-29 1976-03-05 Inoue Japax Res METSUKIHOHO
JPS5127822A (en) * 1974-09-02 1976-03-09 Inoue Japax Res METSUKISOCHI
JPS5274536A (en) * 1975-11-17 1977-06-22 Schering Ag Process and apparatus for selectively plating metals

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508025A (en) * 1973-05-25 1975-01-28
JPS5125434A (en) * 1974-08-28 1976-03-02 Inoue Japax Res RENZOKUMET SUKISOCHI
JPS5126642A (en) * 1974-08-29 1976-03-05 Inoue Japax Res METSUKIHOHO
JPS5127822A (en) * 1974-09-02 1976-03-09 Inoue Japax Res METSUKISOCHI
JPS5274536A (en) * 1975-11-17 1977-06-22 Schering Ag Process and apparatus for selectively plating metals

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032234A (en) * 1988-12-20 1991-07-16 Minolta Camera Kabushiki Kaisha Process for plating a printed circuit board
KR20030083905A (en) * 2002-04-23 2003-11-01 (주)에스티디 Method And Apparatus For Partial Plating On A Surface Or A Section Of Pure Metal Or Alloys
JP4828417B2 (en) * 2003-06-27 2011-11-30 ラム リサーチ コーポレーション Electroplating equipment
EP2085503A1 (en) * 2008-01-31 2009-08-05 HDO -Druckguss- und Oberflächentechnik GmbH Method and device for producing components
JP2009270182A (en) * 2008-05-12 2009-11-19 Suzuki Motor Corp Plating treatment line
WO2021177035A1 (en) * 2020-03-02 2021-09-10 東京エレクトロン株式会社 Plating treatment device
JPWO2021177035A1 (en) * 2020-03-02 2021-09-10
US12571120B2 (en) 2020-03-02 2026-03-10 Tokyo Electron Limited Plating apparatus

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