JPS54129976A - Ic lead frame - Google Patents

Ic lead frame

Info

Publication number
JPS54129976A
JPS54129976A JP3771778A JP3771778A JPS54129976A JP S54129976 A JPS54129976 A JP S54129976A JP 3771778 A JP3771778 A JP 3771778A JP 3771778 A JP3771778 A JP 3771778A JP S54129976 A JPS54129976 A JP S54129976A
Authority
JP
Japan
Prior art keywords
chip
layer
onto
alloy
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3771778A
Other languages
Japanese (ja)
Other versions
JPS5936426B2 (en
Inventor
Tomoyuki Furuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP3771778A priority Critical patent/JPS5936426B2/en
Publication of JPS54129976A publication Critical patent/JPS54129976A/en
Publication of JPS5936426B2 publication Critical patent/JPS5936426B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain resistance to a high temperature, to maintain excellent solderability, and to prevent the breakdown of a chip, by providing an Ag layer onto the Sn-Ni alloy layer at an edge part inside of a lead where the fixing part of the IC chip is connected to the chip.
CONSTITUTION: After thermal oxidation, Sn-Ni alloy maintains excellent solderability and also suppresses whisker growth of Sn. For the purpose, a Sn-Ni alloy layer is provided onto the entire metal substrate first and an Ag plating layer is provided partially onto it. As a result, a grown Sn whisker will never penetrate the Ag layer to break the chip of a Si thin plate of insufficient elasticity like a pure-Sn plating layer, so that a lead frame of good quality can be obtained.
COPYRIGHT: (C)1979,JPO&Japio
JP3771778A 1978-03-31 1978-03-31 IC lead frame Expired JPS5936426B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3771778A JPS5936426B2 (en) 1978-03-31 1978-03-31 IC lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3771778A JPS5936426B2 (en) 1978-03-31 1978-03-31 IC lead frame

Publications (2)

Publication Number Publication Date
JPS54129976A true JPS54129976A (en) 1979-10-08
JPS5936426B2 JPS5936426B2 (en) 1984-09-04

Family

ID=12505258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3771778A Expired JPS5936426B2 (en) 1978-03-31 1978-03-31 IC lead frame

Country Status (1)

Country Link
JP (1) JPS5936426B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175754A (en) * 1983-03-26 1984-10-04 Furukawa Electric Co Ltd:The Lead frame for integrated circuit
JPS60147145A (en) * 1984-01-10 1985-08-03 Hitachi Cable Ltd Lead frame for semiconductor
JPS60225456A (en) * 1984-04-24 1985-11-09 Hitachi Cable Ltd Lead frame for semiconductor
JPS6149451A (en) * 1984-08-17 1986-03-11 Hitachi Cable Ltd Lead frame for semiconductor
JPS61121746U (en) * 1985-01-16 1986-07-31
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
JPS63150949A (en) * 1986-12-12 1988-06-23 Nippon Chem Denshi Kk Lead frame for semiconductor and manufacture thereof
US6207298B1 (en) * 1997-12-25 2001-03-27 Japan Solderless Terminal Mfg. Co., Ltd. Connector surface-treated with a Sn-Ni alloy
WO2020235292A1 (en) * 2019-05-23 2020-11-26 古河電気工業株式会社 Lead frame member, manufacturing method thereof, lead frame and electrical or electronic component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175754A (en) * 1983-03-26 1984-10-04 Furukawa Electric Co Ltd:The Lead frame for integrated circuit
JPS60147145A (en) * 1984-01-10 1985-08-03 Hitachi Cable Ltd Lead frame for semiconductor
JPS60225456A (en) * 1984-04-24 1985-11-09 Hitachi Cable Ltd Lead frame for semiconductor
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
JPS6149451A (en) * 1984-08-17 1986-03-11 Hitachi Cable Ltd Lead frame for semiconductor
JPS61121746U (en) * 1985-01-16 1986-07-31
JPS63150949A (en) * 1986-12-12 1988-06-23 Nippon Chem Denshi Kk Lead frame for semiconductor and manufacture thereof
US6207298B1 (en) * 1997-12-25 2001-03-27 Japan Solderless Terminal Mfg. Co., Ltd. Connector surface-treated with a Sn-Ni alloy
WO2020235292A1 (en) * 2019-05-23 2020-11-26 古河電気工業株式会社 Lead frame member, manufacturing method thereof, lead frame and electrical or electronic component

Also Published As

Publication number Publication date
JPS5936426B2 (en) 1984-09-04

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