JPS54145332A - Electroforming method - Google Patents
Electroforming methodInfo
- Publication number
- JPS54145332A JPS54145332A JP5329678A JP5329678A JPS54145332A JP S54145332 A JPS54145332 A JP S54145332A JP 5329678 A JP5329678 A JP 5329678A JP 5329678 A JP5329678 A JP 5329678A JP S54145332 A JPS54145332 A JP S54145332A
- Authority
- JP
- Japan
- Prior art keywords
- electrodeposition
- hole
- uniform
- photosensitive
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000005323 electroforming Methods 0.000 title 1
- 238000004070 electrodeposition Methods 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 4
- 239000000126 substance Substances 0.000 abstract 3
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
PURPOSE: To obtain uniform thickness of metal part crystallized by electrodeposition by forming small circular holes other than a hole of the shape of part in a photosensitive and chemical resistant film coated on a base plate.
CONSTITUTION: The photosensitive and chemical resistant film 12 is coated on the matrix metal base plate 11, exposed to light by photographic processing, and then removed by dissolution by a developing solution to form the hole 13 of the shape of part. At the same time, a plural number of small circular holes 14 in such a way that ratio of the base plate exposed area of the hole 13 portion to the insulating area of the photosensitive and chemical resistant film 12 is almost uniform. Thus, current line in electrodeposition process is distributed even into the small circular hole 14, whereby the current density in a portion of a broad exposure width becomes similar to that in a portion of a shallow exposure width and thus the thickness of crystallized metal part becomes uniform. In addition, electrodeposition stress becomes almost constant and thus the control of electrodeposition stress can be made easier by electrodeposition conditions. Furthermore, no secondary processing such as buffing, etc., is required because of uniform crystallization of metal part.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5329678A JPS54145332A (en) | 1978-05-06 | 1978-05-06 | Electroforming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5329678A JPS54145332A (en) | 1978-05-06 | 1978-05-06 | Electroforming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54145332A true JPS54145332A (en) | 1979-11-13 |
Family
ID=12938752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5329678A Pending JPS54145332A (en) | 1978-05-06 | 1978-05-06 | Electroforming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54145332A (en) |
-
1978
- 1978-05-06 JP JP5329678A patent/JPS54145332A/en active Pending
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