JPS5419363A - Die bonding method of semiconductor devices - Google Patents

Die bonding method of semiconductor devices

Info

Publication number
JPS5419363A
JPS5419363A JP8435177A JP8435177A JPS5419363A JP S5419363 A JPS5419363 A JP S5419363A JP 8435177 A JP8435177 A JP 8435177A JP 8435177 A JP8435177 A JP 8435177A JP S5419363 A JPS5419363 A JP S5419363A
Authority
JP
Japan
Prior art keywords
semiconductor devices
bonding method
die bonding
paste
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8435177A
Other languages
Japanese (ja)
Other versions
JPS5729843B2 (en
Inventor
Masao Yamazaki
Masami Hasegawa
Hisaaki Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP8435177A priority Critical patent/JPS5419363A/en
Publication of JPS5419363A publication Critical patent/JPS5419363A/en
Publication of JPS5729843B2 publication Critical patent/JPS5729843B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To coat a small volume of paste to a chip by opposing the chip affixed on a sheet surface to a plate coated with paste in film form and rubbing the back of the sheet.
COPYRIGHT: (C)1979,JPO&Japio
JP8435177A 1977-07-13 1977-07-13 Die bonding method of semiconductor devices Granted JPS5419363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8435177A JPS5419363A (en) 1977-07-13 1977-07-13 Die bonding method of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8435177A JPS5419363A (en) 1977-07-13 1977-07-13 Die bonding method of semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5419363A true JPS5419363A (en) 1979-02-14
JPS5729843B2 JPS5729843B2 (en) 1982-06-25

Family

ID=13828088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8435177A Granted JPS5419363A (en) 1977-07-13 1977-07-13 Die bonding method of semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5419363A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221369A (en) * 1983-05-30 1984-12-12 Mitsubishi Electric Corp Method for bonding semiconductor chip
JPS6049636A (en) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd Mounting method of chip
JPS6049635A (en) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd Mounting method of chip
DE102004019567B3 (en) * 2004-04-22 2006-01-12 Semikron Elektronik Gmbh & Co. Kg Securing electronic components to substrate by subjecting the electronic component, supporting film and paste-like layer to pressure and connecting the substrate and the component by sintering
DE102004056702B3 (en) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Method for mounting electronic components on a substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106152U (en) * 1983-12-23 1985-07-19 マークテック株式会社 ultraviolet flaw detection lamp

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59221369A (en) * 1983-05-30 1984-12-12 Mitsubishi Electric Corp Method for bonding semiconductor chip
JPS6049636A (en) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd Mounting method of chip
JPS6049635A (en) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd Mounting method of chip
DE102004019567B3 (en) * 2004-04-22 2006-01-12 Semikron Elektronik Gmbh & Co. Kg Securing electronic components to substrate by subjecting the electronic component, supporting film and paste-like layer to pressure and connecting the substrate and the component by sintering
DE102004056702B3 (en) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Method for mounting electronic components on a substrate
US8662377B2 (en) 2004-04-22 2014-03-04 Semikron Elektronik Gmbh & Co., Kg Method for securing electronic components to a substrate

Also Published As

Publication number Publication date
JPS5729843B2 (en) 1982-06-25

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