JPS5420663A - Grinding method of semiconductor wafers - Google Patents

Grinding method of semiconductor wafers

Info

Publication number
JPS5420663A
JPS5420663A JP8514177A JP8514177A JPS5420663A JP S5420663 A JPS5420663 A JP S5420663A JP 8514177 A JP8514177 A JP 8514177A JP 8514177 A JP8514177 A JP 8514177A JP S5420663 A JPS5420663 A JP S5420663A
Authority
JP
Japan
Prior art keywords
wafers
semiconductor wafers
grinding method
grinding wheel
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8514177A
Other languages
Japanese (ja)
Inventor
Hidetoshi Nagasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8514177A priority Critical patent/JPS5420663A/en
Publication of JPS5420663A publication Critical patent/JPS5420663A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To efficiently perform the end face grinding of wafers by holding the wafers in such a manner that they do not detach from a grinding wheel with varying diameters of the grinding wheel making contact to the end faces of the wafers during rotating of the grinding wheel thereby performing beveling of curved faces.
COPYRIGHT: (C)1979,JPO&Japio
JP8514177A 1977-07-18 1977-07-18 Grinding method of semiconductor wafers Pending JPS5420663A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8514177A JPS5420663A (en) 1977-07-18 1977-07-18 Grinding method of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8514177A JPS5420663A (en) 1977-07-18 1977-07-18 Grinding method of semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS5420663A true JPS5420663A (en) 1979-02-16

Family

ID=13850373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8514177A Pending JPS5420663A (en) 1977-07-18 1977-07-18 Grinding method of semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5420663A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113332A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Manufacture of wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113332A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Manufacture of wafer

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