JPS5373075A - Treatment method for wafer surface - Google Patents

Treatment method for wafer surface

Info

Publication number
JPS5373075A
JPS5373075A JP14963476A JP14963476A JPS5373075A JP S5373075 A JPS5373075 A JP S5373075A JP 14963476 A JP14963476 A JP 14963476A JP 14963476 A JP14963476 A JP 14963476A JP S5373075 A JPS5373075 A JP S5373075A
Authority
JP
Japan
Prior art keywords
wafer surface
treatment method
metal
forming
grain size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14963476A
Other languages
Japanese (ja)
Other versions
JPS563662B2 (en
Inventor
Niwaji Majima
Mieko Yoshimaru
Shunsuke Matsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14963476A priority Critical patent/JPS5373075A/en
Publication of JPS5373075A publication Critical patent/JPS5373075A/en
Publication of JPS563662B2 publication Critical patent/JPS563662B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To form a rough surface on a wafer surface by forming the metal-evaporated layer of a prescribed grain size on the wafer surface and then by removing it through ion etching.
COPYRIGHT: (C)1978,JPO&Japio
JP14963476A 1976-12-13 1976-12-13 Treatment method for wafer surface Granted JPS5373075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14963476A JPS5373075A (en) 1976-12-13 1976-12-13 Treatment method for wafer surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14963476A JPS5373075A (en) 1976-12-13 1976-12-13 Treatment method for wafer surface

Publications (2)

Publication Number Publication Date
JPS5373075A true JPS5373075A (en) 1978-06-29
JPS563662B2 JPS563662B2 (en) 1981-01-26

Family

ID=15479503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14963476A Granted JPS5373075A (en) 1976-12-13 1976-12-13 Treatment method for wafer surface

Country Status (1)

Country Link
JP (1) JPS5373075A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141925A (en) * 1980-12-19 1982-09-02 Western Electric Co Method of producing semiconductor device
JP2005510884A (en) * 2001-11-29 2005-04-21 オリジン エナジー ソーラー ピーティーワイ リミテッド Semiconductor texturing process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111090A (en) * 1975-03-26 1976-10-01 Hitachi Ltd Semiconductor device manufacturing process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111090A (en) * 1975-03-26 1976-10-01 Hitachi Ltd Semiconductor device manufacturing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141925A (en) * 1980-12-19 1982-09-02 Western Electric Co Method of producing semiconductor device
JP2005510884A (en) * 2001-11-29 2005-04-21 オリジン エナジー ソーラー ピーティーワイ リミテッド Semiconductor texturing process

Also Published As

Publication number Publication date
JPS563662B2 (en) 1981-01-26

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