JPS5420681A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5420681A JPS5420681A JP8512277A JP8512277A JPS5420681A JP S5420681 A JPS5420681 A JP S5420681A JP 8512277 A JP8512277 A JP 8512277A JP 8512277 A JP8512277 A JP 8512277A JP S5420681 A JPS5420681 A JP S5420681A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- semiconductor device
- constitute
- mixed
- way
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000010410 layer Substances 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8512277A JPS5917853B2 (ja) | 1977-07-18 | 1977-07-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8512277A JPS5917853B2 (ja) | 1977-07-18 | 1977-07-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5420681A true JPS5420681A (en) | 1979-02-16 |
| JPS5917853B2 JPS5917853B2 (ja) | 1984-04-24 |
Family
ID=13849819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8512277A Expired JPS5917853B2 (ja) | 1977-07-18 | 1977-07-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5917853B2 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59194467A (ja) * | 1983-04-20 | 1984-11-05 | Toshiba Corp | 半導体装置 |
| US4625228A (en) * | 1983-11-30 | 1986-11-25 | W.C. Heraeus Gmbh | Multi-layer electrical support substrate |
| JPH0228955A (ja) * | 1988-03-07 | 1990-01-31 | Internatl Business Mach Corp <Ibm> | 多層配線層の形成方法 |
| JPH02297936A (ja) * | 1989-05-12 | 1990-12-10 | Oki Electric Ind Co Ltd | 半導体装置の配線用アルミニウム合金材料 |
| JPH02297937A (ja) * | 1989-05-12 | 1990-12-10 | Oki Electric Ind Co Ltd | 半導体装置の配線用アルミニウム合金材料 |
-
1977
- 1977-07-18 JP JP8512277A patent/JPS5917853B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59194467A (ja) * | 1983-04-20 | 1984-11-05 | Toshiba Corp | 半導体装置 |
| US4625228A (en) * | 1983-11-30 | 1986-11-25 | W.C. Heraeus Gmbh | Multi-layer electrical support substrate |
| JPH0228955A (ja) * | 1988-03-07 | 1990-01-31 | Internatl Business Mach Corp <Ibm> | 多層配線層の形成方法 |
| JPH02297936A (ja) * | 1989-05-12 | 1990-12-10 | Oki Electric Ind Co Ltd | 半導体装置の配線用アルミニウム合金材料 |
| JPH02297937A (ja) * | 1989-05-12 | 1990-12-10 | Oki Electric Ind Co Ltd | 半導体装置の配線用アルミニウム合金材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5917853B2 (ja) | 1984-04-24 |
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