JPS5420681A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5420681A
JPS5420681A JP8512277A JP8512277A JPS5420681A JP S5420681 A JPS5420681 A JP S5420681A JP 8512277 A JP8512277 A JP 8512277A JP 8512277 A JP8512277 A JP 8512277A JP S5420681 A JPS5420681 A JP S5420681A
Authority
JP
Japan
Prior art keywords
metal layer
semiconductor device
constitute
mixed
way
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8512277A
Other languages
Japanese (ja)
Other versions
JPS5917853B2 (en
Inventor
Masaharu Aoyama
Shunichi Kai
Toshio Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8512277A priority Critical patent/JPS5917853B2/en
Publication of JPS5420681A publication Critical patent/JPS5420681A/en
Publication of JPS5917853B2 publication Critical patent/JPS5917853B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To constitute a first metal layer with Al mixed with a small quantity of Si and Cu and make positive interlayer insulation at the time of forming multilayer wirings with the first metal layer wired and connected to active elements and the second metal layer crossing with this by way of insulating layer.
COPYRIGHT: (C)1979,JPO&Japio
JP8512277A 1977-07-18 1977-07-18 semiconductor equipment Expired JPS5917853B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8512277A JPS5917853B2 (en) 1977-07-18 1977-07-18 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8512277A JPS5917853B2 (en) 1977-07-18 1977-07-18 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5420681A true JPS5420681A (en) 1979-02-16
JPS5917853B2 JPS5917853B2 (en) 1984-04-24

Family

ID=13849819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8512277A Expired JPS5917853B2 (en) 1977-07-18 1977-07-18 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5917853B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194467A (en) * 1983-04-20 1984-11-05 Toshiba Corp Wiring material of semiconductor device
US4625228A (en) * 1983-11-30 1986-11-25 W.C. Heraeus Gmbh Multi-layer electrical support substrate
JPH0228955A (en) * 1988-03-07 1990-01-31 Internatl Business Mach Corp <Ibm> Method of forming multilayer wiring
JPH02297936A (en) * 1989-05-12 1990-12-10 Oki Electric Ind Co Ltd Wiring aluminum alloy material of semiconductor device
JPH02297937A (en) * 1989-05-12 1990-12-10 Oki Electric Ind Co Ltd Wiring aluminum alloy material of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194467A (en) * 1983-04-20 1984-11-05 Toshiba Corp Wiring material of semiconductor device
US4625228A (en) * 1983-11-30 1986-11-25 W.C. Heraeus Gmbh Multi-layer electrical support substrate
JPH0228955A (en) * 1988-03-07 1990-01-31 Internatl Business Mach Corp <Ibm> Method of forming multilayer wiring
JPH02297936A (en) * 1989-05-12 1990-12-10 Oki Electric Ind Co Ltd Wiring aluminum alloy material of semiconductor device
JPH02297937A (en) * 1989-05-12 1990-12-10 Oki Electric Ind Co Ltd Wiring aluminum alloy material of semiconductor device

Also Published As

Publication number Publication date
JPS5917853B2 (en) 1984-04-24

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