JPS5422788A - Semiconductor light emittsing device - Google Patents

Semiconductor light emittsing device

Info

Publication number
JPS5422788A
JPS5422788A JP8818977A JP8818977A JPS5422788A JP S5422788 A JPS5422788 A JP S5422788A JP 8818977 A JP8818977 A JP 8818977A JP 8818977 A JP8818977 A JP 8818977A JP S5422788 A JPS5422788 A JP S5422788A
Authority
JP
Japan
Prior art keywords
emittsing
semiconductor light
light emitting
molding
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8818977A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Hayakawa
Osamu Iwashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8818977A priority Critical patent/JPS5422788A/en
Publication of JPS5422788A publication Critical patent/JPS5422788A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: To expand the light emitting surface and thus to increase the luminous output by molding the space ranging from the main light emitting surface through the light emitting diode pellet with the transparent resin and molding the space from the back of the opposite side through the pellet with the scattering agent or the reflective agent respectively.
COPYRIGHT: (C)1979,JPO&Japio
JP8818977A 1977-07-21 1977-07-21 Semiconductor light emittsing device Pending JPS5422788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8818977A JPS5422788A (en) 1977-07-21 1977-07-21 Semiconductor light emittsing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8818977A JPS5422788A (en) 1977-07-21 1977-07-21 Semiconductor light emittsing device

Publications (1)

Publication Number Publication Date
JPS5422788A true JPS5422788A (en) 1979-02-20

Family

ID=13935944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8818977A Pending JPS5422788A (en) 1977-07-21 1977-07-21 Semiconductor light emittsing device

Country Status (1)

Country Link
JP (1) JPS5422788A (en)

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