JPS5423568U - - Google Patents
Info
- Publication number
- JPS5423568U JPS5423568U JP1977096660U JP9666077U JPS5423568U JP S5423568 U JPS5423568 U JP S5423568U JP 1977096660 U JP1977096660 U JP 1977096660U JP 9666077 U JP9666077 U JP 9666077U JP S5423568 U JPS5423568 U JP S5423568U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977096660U JPS5423568U (2) | 1977-07-19 | 1977-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977096660U JPS5423568U (2) | 1977-07-19 | 1977-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5423568U true JPS5423568U (2) | 1979-02-16 |
Family
ID=29030749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977096660U Pending JPS5423568U (2) | 1977-07-19 | 1977-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5423568U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195856A (ja) * | 1983-04-20 | 1984-11-07 | Fujitsu Ltd | 半導体装置及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147667A (2) * | 1974-05-16 | 1975-11-26 |
-
1977
- 1977-07-19 JP JP1977096660U patent/JPS5423568U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147667A (2) * | 1974-05-16 | 1975-11-26 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195856A (ja) * | 1983-04-20 | 1984-11-07 | Fujitsu Ltd | 半導体装置及びその製造方法 |