JPS50147667A - - Google Patents
Info
- Publication number
- JPS50147667A JPS50147667A JP49054736A JP5473674A JPS50147667A JP S50147667 A JPS50147667 A JP S50147667A JP 49054736 A JP49054736 A JP 49054736A JP 5473674 A JP5473674 A JP 5473674A JP S50147667 A JPS50147667 A JP S50147667A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49054736A JPS50147667A (2) | 1974-05-16 | 1974-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49054736A JPS50147667A (2) | 1974-05-16 | 1974-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50147667A true JPS50147667A (2) | 1975-11-26 |
Family
ID=12979060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49054736A Pending JPS50147667A (2) | 1974-05-16 | 1974-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50147667A (2) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145464U (2) * | 1977-03-25 | 1978-11-16 | ||
| JPS5423568U (2) * | 1977-07-19 | 1979-02-16 | ||
| JPS54172765U (2) * | 1978-05-25 | 1979-12-06 | ||
| JPS5787542U (2) * | 1980-11-14 | 1982-05-29 | ||
| JPS5851525A (ja) * | 1981-09-22 | 1983-03-26 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
-
1974
- 1974-05-16 JP JP49054736A patent/JPS50147667A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145464U (2) * | 1977-03-25 | 1978-11-16 | ||
| JPS5423568U (2) * | 1977-07-19 | 1979-02-16 | ||
| JPS54172765U (2) * | 1978-05-25 | 1979-12-06 | ||
| JPS5787542U (2) * | 1980-11-14 | 1982-05-29 | ||
| JPS5851525A (ja) * | 1981-09-22 | 1983-03-26 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |