JPS5426469B2 - - Google Patents
Info
- Publication number
- JPS5426469B2 JPS5426469B2 JP7656075A JP7656075A JPS5426469B2 JP S5426469 B2 JPS5426469 B2 JP S5426469B2 JP 7656075 A JP7656075 A JP 7656075A JP 7656075 A JP7656075 A JP 7656075A JP S5426469 B2 JPS5426469 B2 JP S5426469B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50076560A JPS522167A (en) | 1975-06-24 | 1975-06-24 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50076560A JPS522167A (en) | 1975-06-24 | 1975-06-24 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS522167A JPS522167A (en) | 1977-01-08 |
| JPS5426469B2 true JPS5426469B2 (ja) | 1979-09-04 |
Family
ID=13608619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50076560A Granted JPS522167A (en) | 1975-06-24 | 1975-06-24 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS522167A (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62105207A (ja) * | 1985-10-31 | 1987-05-15 | Sanyo Electric Co Ltd | 移動ロボツトの誘導装置 |
-
1975
- 1975-06-24 JP JP50076560A patent/JPS522167A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS522167A (en) | 1977-01-08 |