JPS522167A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS522167A
JPS522167A JP50076560A JP7656075A JPS522167A JP S522167 A JPS522167 A JP S522167A JP 50076560 A JP50076560 A JP 50076560A JP 7656075 A JP7656075 A JP 7656075A JP S522167 A JPS522167 A JP S522167A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding method
wire
improper
shortcircuiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50076560A
Other languages
Japanese (ja)
Other versions
JPS5426469B2 (en
Inventor
Naoji Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50076560A priority Critical patent/JPS522167A/en
Publication of JPS522167A publication Critical patent/JPS522167A/en
Publication of JPS5426469B2 publication Critical patent/JPS5426469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To provide a wire bonding method which can prevent improper shortcircuiting by preventing explosion due to improper bonding of wire to solder electrode at wire bonding process.
COPYRIGHT: (C)1977,JPO&Japio
JP50076560A 1975-06-24 1975-06-24 Wire bonding method Granted JPS522167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50076560A JPS522167A (en) 1975-06-24 1975-06-24 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50076560A JPS522167A (en) 1975-06-24 1975-06-24 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS522167A true JPS522167A (en) 1977-01-08
JPS5426469B2 JPS5426469B2 (en) 1979-09-04

Family

ID=13608619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50076560A Granted JPS522167A (en) 1975-06-24 1975-06-24 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS522167A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105207A (en) * 1985-10-31 1987-05-15 Sanyo Electric Co Ltd Guiding device for mobile robot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105207A (en) * 1985-10-31 1987-05-15 Sanyo Electric Co Ltd Guiding device for mobile robot

Also Published As

Publication number Publication date
JPS5426469B2 (en) 1979-09-04

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