JPS5433659A - Bonding wire - Google Patents

Bonding wire

Info

Publication number
JPS5433659A
JPS5433659A JP9959477A JP9959477A JPS5433659A JP S5433659 A JPS5433659 A JP S5433659A JP 9959477 A JP9959477 A JP 9959477A JP 9959477 A JP9959477 A JP 9959477A JP S5433659 A JPS5433659 A JP S5433659A
Authority
JP
Japan
Prior art keywords
metals
bonding wire
junction
bonding
feasible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9959477A
Other languages
Japanese (ja)
Other versions
JPS6022826B2 (en
Inventor
Takehisa Hamano
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52099594A priority Critical patent/JPS6022826B2/en
Publication of JPS5433659A publication Critical patent/JPS5433659A/en
Publication of JPS6022826B2 publication Critical patent/JPS6022826B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent feasible junction caused by the production of intermetallic compound due to bonding between different types of metals, by forming junction with the same types of metals or metals not causing intermetallic compounds.
COPYRIGHT: (C)1979,JPO&Japio
JP52099594A 1977-08-22 1977-08-22 bonding wire Expired JPS6022826B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52099594A JPS6022826B2 (en) 1977-08-22 1977-08-22 bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52099594A JPS6022826B2 (en) 1977-08-22 1977-08-22 bonding wire

Publications (2)

Publication Number Publication Date
JPS5433659A true JPS5433659A (en) 1979-03-12
JPS6022826B2 JPS6022826B2 (en) 1985-06-04

Family

ID=14251413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52099594A Expired JPS6022826B2 (en) 1977-08-22 1977-08-22 bonding wire

Country Status (1)

Country Link
JP (1) JPS6022826B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225450A (en) * 1984-04-24 1985-11-09 Furukawa Electric Co Ltd:The Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225450A (en) * 1984-04-24 1985-11-09 Furukawa Electric Co Ltd:The Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6022826B2 (en) 1985-06-04

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