JPS5437680A - Wire bonding unit - Google Patents

Wire bonding unit

Info

Publication number
JPS5437680A
JPS5437680A JP10458677A JP10458677A JPS5437680A JP S5437680 A JPS5437680 A JP S5437680A JP 10458677 A JP10458677 A JP 10458677A JP 10458677 A JP10458677 A JP 10458677A JP S5437680 A JPS5437680 A JP S5437680A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding unit
cam
movement
stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10458677A
Other languages
Japanese (ja)
Inventor
Kazuo Kachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10458677A priority Critical patent/JPS5437680A/en
Publication of JPS5437680A publication Critical patent/JPS5437680A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To considerably reduce mechanical vibration, by providing the cam rotation Z motor giving the movement of up, down and Z direction with the bonding arm apart from the horizontal stand, and by delivering the Z motor revolution to the cam while the movement toward X and Y direction of the horizontal moving stand are absorbed.
COPYRIGHT: (C)1979,JPO&Japio
JP10458677A 1977-08-31 1977-08-31 Wire bonding unit Pending JPS5437680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10458677A JPS5437680A (en) 1977-08-31 1977-08-31 Wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10458677A JPS5437680A (en) 1977-08-31 1977-08-31 Wire bonding unit

Publications (1)

Publication Number Publication Date
JPS5437680A true JPS5437680A (en) 1979-03-20

Family

ID=14384531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10458677A Pending JPS5437680A (en) 1977-08-31 1977-08-31 Wire bonding unit

Country Status (1)

Country Link
JP (1) JPS5437680A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63315520A (en) * 1987-06-17 1988-12-23 Nec Corp Production of ferrite

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63315520A (en) * 1987-06-17 1988-12-23 Nec Corp Production of ferrite

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